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  • Manufacturer No:
    KMPC866PVR133A
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    KMPC866PVR133A
  • SKU:
    10943936
  • Description:
    FIXED POINT MICROPROCESSOR RISC BOTTOM BALL IC Microprocessor 95C 25mm 1.8V 32b

KMPC866PVR133A Details

FIXED POINT MICROPROCESSOR RISC BOTTOM BALL IC Microprocessor 95C 25mm 1.8V 32b

KMPC866PVR133A Specification Parameters

  • Packaging: Bulk
  • RoHS Status: RoHS Compliant
  • Surface Mount: YES
  • Boundary Scan: YES
  • Lead Free: Lead Free
  • Technology: CMOS
  • Supply Voltage: 1.8V
  • Bit Size: 32
  • Terminal Position: BOTTOM
  • Terminal Form: BALL
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Length: 25mm
  • Data Bus Width: 32b
  • Frequency (Max): 133MHz
  • RAM Size: 8kB
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • Number of Terminations: 357
  • Pin Count: 357
  • Weight: 2.094208g
  • Number of Cores: 1
  • Radiation Hardening: No
  • Low Power Mode: YES
  • Integrated Cache: YES
  • Moisture Sensitivity Level (MSL): 3
  • Time@Peak Reflow Temperature-Max (s): 30
  • Operating Supply Voltage: 1.8V
  • Address Bus Width: 32
  • Min Operating Temperature: 0°C
  • JESD-609 Code: e1
  • Halogen Free: Halogen Free
  • Peak Reflow Temperature (Cel): 245
  • Frequency: 133MHz
  • Package / Case: BGA
  • Format: FIXED POINT
  • Max Operating Temperature: 95°C
  • Number of Pins: 357
  • Height Seated (Max): 2.52mm
  • Additional Feature: REQUIRES 3.3V SUPPLY FOR I/O

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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