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- Manufacturer No：KMPC8260AZUPJDB
- Manufacturer：Freescale Semiconductor, Inc. (NXP Semiconductors)
- Category：Embedded - Microprocessors
- Datasheet：KMPC8260AZUPJDB
- SKU：10957503
- Description：FLOATING POINT MICROPROCESSOR RISC Not Qualified BALL IC Microprocessor 105C 37.5mm 2.7V 32b
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KMPC8260AZUPJDB Details
FLOATING POINT MICROPROCESSOR RISC Not Qualified BALL IC Microprocessor 105C 37.5mm 2.7V 32b
KMPC8260AZUPJDB Specification Parameters
- Low Power Mode: NO
- Number of Cores: 1
- Surface Mount: YES
- Integrated Cache: YES
- Temperature Grade: COMMERCIAL
- Qualification Status: Not Qualified
- Technology: CMOS
- Reach Compliance Code: not_compliant
- Bit Size: 32
- Supply Voltage: 2V
- Operating Supply Voltage: 2.7V
- Terminal Form: BALL
- Data Bus Width: 32b
- Frequency: 300MHz
- Peak Reflow Temperature (Cel): 220
- Halogen Free: Not Halogen Free
- Format: FLOATING POINT
- Number of Terminations: 480
- Pin Count: 480
- Weight: 10.163049g
- Packaging: Bulk
- RoHS Status: Non-RoHS Compliant
- Boundary Scan: YES
- Moisture Sensitivity Level (MSL): 3
- Lead Free: Contains Lead
- JESD-609 Code: e0
- Time@Peak Reflow Temperature-Max (s): 30
- Max Operating Temperature: 105°C
- Address Bus Width: 32
- Terminal Position: BOTTOM
- Min Operating Temperature: 0°C
- Terminal Finish: TIN LEAD
- Supply Voltage-Max (Vsup): 2.2V
- Frequency (Max): 300MHz
- uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
- Subcategory: Microprocessors
- Length: 37.5mm
- Number of Pins: 480
- Power Supplies: 2.53.3V
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Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.
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