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- Manufacturer No：KMPC870CZT133
- Manufacturer：Freescale Semiconductor, Inc. (NXP Semiconductors)
- Category：Embedded - Microprocessors
- Datasheet：KMPC870CZT133
- SKU：10958005
- Description：FIXED POINT MICROPROCESSOR RISC Not Qualified BALL IC Microprocessor 100C 23mm 1.8V 32b
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User Guide
KMPC870CZT133 Details
FIXED POINT MICROPROCESSOR RISC Not Qualified BALL IC Microprocessor 100C 23mm 1.8V 32b
KMPC870CZT133 Specification Parameters
- Packaging: Bulk
- RoHS Status: Non-RoHS Compliant
- Low Power Mode: YES
- Integrated Cache: YES
- Lead Free: Contains Lead
- Min Operating Temperature: -40°C
- Height Seated (Max): 2.54mm
- Time@Peak Reflow Temperature-Max (s): 30
- Operating Supply Voltage: 1.8V
- Bit Size: 32
- Terminal Position: BOTTOM
- Terminal Finish: TIN LEAD
- Peak Reflow Temperature (Cel): 245
- Number of Pins: 256
- Data Bus Width: 32b
- Frequency: 133MHz
- Package / Case: BGA
- Format: FIXED POINT
- Halogen Free: Not Halogen Free
- ECCN Code: 5A992
- Number of Cores: 1
- Surface Mount: YES
- Boundary Scan: YES
- Moisture Sensitivity Level (MSL): 3
- Qualification Status: Not Qualified
- JESD-609 Code: e0
- Technology: CMOS
- Supply Voltage: 1.8V
- Reach Compliance Code: not_compliant
- Address Bus Width: 32
- Terminal Form: BALL
- Max Operating Temperature: 100°C
- Number of Terminations: 256
- Pin Count: 256
- Length: 23mm
- Frequency (Max): 133MHz
- RAM Size: 8kB
- uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
- Subcategory: Microprocessors
- Weight: 1.724048g
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Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.
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