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  • Manufacturer No:
    MC68MH360ZP33L
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MC68MH360ZP33L
  • SKU:
    10958404
  • Description:
    Contains Lead SERIAL IO/COMMUNICATION CONTROLLER LAN 68000 BALL IC Microprocessor 70C 25mm 4.75V 33MHz

MC68MH360ZP33L Details

Contains Lead SERIAL IO/COMMUNICATION CONTROLLER LAN 68000 BALL IC Microprocessor 70C 25mm 4.75V 33MHz

MC68MH360ZP33L Specification Parameters

  • Packaging: Bulk
  • RoHS Status: RoHS Compliant
  • Low Power Mode: YES
  • Supply Voltage: 5V
  • Moisture Sensitivity Level (MSL): 3
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Time@Peak Reflow Temperature-Max (s): 30
  • Address Bus Width: 32
  • Min Operating Temperature: 0°C
  • Terminal Finish: TIN LEAD
  • Width: 25mm
  • Technology: HCMOS
  • Frequency: 33MHz
  • Package / Case: BGA
  • Number of Terminations: 357
  • uPs/uCs/Peripheral ICs Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN
  • Communication Protocol: ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
  • Number of Cores: 1
  • Surface Mount: YES
  • Boundary Scan: YES
  • Number of Serial I/Os: 4
  • Temperature Grade: COMMERCIAL
  • Qualification Status: Not Qualified
  • Max Operating Temperature: 70°C
  • External Data Bus Width: 32
  • Terminal Position: BOTTOM
  • Terminal Form: BALL
  • Length: 25mm
  • Supply Voltage-Max (Vsup): 5.25V
  • Supply Voltage-Min (Vsup): 4.75V
  • Peak Reflow Temperature (Cel): 220
  • Halogen Free: Not Halogen Free
  • Pin Count: 357
  • Bus Compatibility: 68000

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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