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  • Manufacturer No:
    MC88915TFN133R2
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers
  • Datasheet:
    MC88915TFN133R2
  • SKU:
    10958576
  • Description:
    QUAD J BEND INDUSTRIAL CMOS (Type) IC 0C 0.75ns 4.57mm 133MHz

MC88915TFN133R2 Details

QUAD J BEND INDUSTRIAL CMOS (Type) IC 0C 0.75ns 4.57mm 133MHz

MC88915TFN133R2 Specification Parameters

  • Mount: Surface Mount
  • Number of Functions: 1
  • Moisture Sensitivity Level (MSL): 1
  • RoHS Status: Non-RoHS Compliant
  • Pbfree Code: no
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Max Operating Temperature: 70°C
  • Reach Compliance Code: not_compliant
  • Number of True Outputs: 7
  • Number of Pins: 28
  • Terminal Position: QUAD
  • Min Operating Temperature: 0°C
  • Height Seated (Max): 4.57mm
  • Supply Voltage-Max (Vsup): 5.25V
  • Input: TTL
  • Peak Reflow Temperature (Cel): 220
  • Package / Case: LCC
  • Packaging: Tape & Reel (TR)
  • Number of Circuits: 1
  • Number of Inverted Outputs: 1
  • Supply Voltage: 5V
  • PLL: Yes
  • Qualification Status: Not Qualified
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Number of Terminations: 28
  • Pin Count: 28
  • Temperature Grade: INDUSTRIAL
  • Terminal Form: J BEND
  • Output Characteristics: 3-STATE
  • Supply Voltage-Min (Vsup): 4.75V
  • Frequency (Max): 133MHz
  • Logic IC Type: PLL BASED CLOCK DRIVER
  • Same Edge Skew-Max (tskwd): 0.75 ns

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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