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  • Manufacturer No:
    MPC9443AE
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Clock/Timing - Clock Buffers, Drivers
  • Datasheet:
    MPC9443AE
  • SKU:
    10959455
  • Description:
    QUAD Not Qualified INDUSTRIAL Surface Mount Clock (Type) IC 85C 350MHz 0.25ns 2.5V

MPC9443AE Details

QUAD Not Qualified INDUSTRIAL Surface Mount Clock (Type) IC 85C 350MHz 0.25ns 2.5V

MPC9443AE Specification Parameters

  • Mount: Surface Mount
  • Number of Circuits: 1
  • Lead Free: Lead Free
  • Qualification Status: Not Qualified
  • Number of True Outputs: 16
  • Max Operating Temperature: 85°C
  • Supply Voltage: 2.5V
  • Terminal Pitch: 0.5mm
  • Terminal Position: QUAD
  • Number of Terminations: 48
  • Pin Count: 48
  • Width: 7mm
  • Supply Voltage-Min (Vsup): 2.375V
  • Frequency (Max): 350MHz
  • Package / Case: LQFP
  • Same Edge Skew-Max (tskwd): 0.25 ns
  • Additional Feature: ALSO OPERATES AT 3.3V SUPPLY
  • Number of Functions: 1
  • RoHS Status: RoHS Compliant
  • Moisture Sensitivity Level (MSL): 3
  • Min Operating Temperature: -40°C
  • Terminal Form: GULL WING
  • Reach Compliance Code: unknown
  • Time@Peak Reflow Temperature-Max (s): 30
  • Input: LVCMOS
  • Temperature Grade: INDUSTRIAL
  • Number of Pins: 48
  • Length: 7mm
  • Output Characteristics: 3-STATE
  • Supply Voltage-Max (Vsup): 2.625V
  • Peak Reflow Temperature (Cel): 220
  • Logic IC Type: LOW SKEW CLOCK DRIVER
  • Propagation Delay (tpd): 6.2 ns
  • Family: 9443

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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