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- Manufacturer No：MC100ES6111FA
- Manufacturer：Freescale Semiconductor, Inc. (NXP Semiconductors)
- Category：Clock/Timing - Clock Buffers, Drivers
- Datasheet：MC100ES6111FA
- SKU：10978310
- Description：QUAD Not Qualified Surface Mount LOW SKEW CLOCK DRIVER Clock (Type) IC 110C 2.7GHz 0.035ns -2.5/-3.3/2.5/3.3V
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User Guide
MC100ES6111FA Details
QUAD Not Qualified Surface Mount LOW SKEW CLOCK DRIVER Clock (Type) IC 110C 2.7GHz 0.035ns -2.5/-3.3/2.5/3.3V
MC100ES6111FA Specification Parameters
- Moisture Sensitivity Level (MSL): 2
- Mount: Surface Mount
- Number of Circuits: 1
- Pbfree Code: no
- Qualification Status: Not Qualified
- JESD-609 Code: e0
- Supply Voltage: 2.5V
- Time@Peak Reflow Temperature-Max (s): 30
- Number of Pins: 32
- Pin Count: 32
- Length: 7mm
- Terminal Pitch: 0.8mm
- Max Operating Temperature: 110°C
- Supply Voltage-Max (Vsup): 2.625V
- Input: ECL
- Subcategory: Clock Drivers
- Frequency (Max): 2.7GHz
- Propagation Delay (tpd): 0.53 ns
- Packaging: Bulk
- Number of Functions: 1
- RoHS Status: RoHS Compliant
- Lead Free: Contains Lead
- Min Operating Temperature: -40°C
- Terminal Form: GULL WING
- Number of True Outputs: 10
- Terminal Finish: Tin/Lead (Sn/Pb)
- Number of Terminations: 32
- Terminal Position: QUAD
- Width: 7mm
- Peak Reflow Temperature (Cel): 245
- Supply Voltage-Min (Vsup): 2.375V
- Technology: ECL
- Package / Case: LQFP
- Logic IC Type: LOW SKEW CLOCK DRIVER
- Same Edge Skew-Max (tskwd): 0.035 ns
- Power Supplies: -2.5/-3.3/2.5/3.3V
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Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.
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