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  • Manufacturer No:
    MPC8360ECZUAGDGA
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MPC8360ECZUAGDGA
  • SKU:
    10979202
  • Description:
    FLOATING POINT MICROPROCESSOR RISC BOTTOM BALL IC Microprocessor 105C 37.5mm 1.26V 32b

MPC8360ECZUAGDGA Details

FLOATING POINT MICROPROCESSOR RISC BOTTOM BALL IC Microprocessor 105C 37.5mm 1.26V 32b

MPC8360ECZUAGDGA Specification Parameters

  • Mount: Surface Mount
  • RoHS Status: RoHS Compliant
  • Low Power Mode: YES
  • Integrated Cache: YES
  • Min Operating Temperature: -40°C
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 40
  • Bit Size: 32
  • Terminal Position: BOTTOM
  • Supply Voltage: 1.2V
  • Halogen Free: Halogen Free
  • Frequency: 400MHz
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • Subcategory: Microprocessors
  • Format: FLOATING POINT
  • Terminal Finish: Tin/Lead/Silver (Sn/Pb/Ag)
  • Number of Terminations: 740
  • ECCN Code: 5A002
  • Number of Cores: 1
  • Radiation Hardening: No
  • Boundary Scan: YES
  • Moisture Sensitivity Level (MSL): 3
  • JESD-609 Code: e0
  • Peak Reflow Temperature (Cel): 260
  • Max Operating Temperature: 105°C
  • Address Bus Width: 32
  • Terminal Form: BALL
  • Operating Supply Voltage: 1.2V
  • Data Bus Width: 32b
  • Frequency (Max): 400MHz
  • Min Supply Voltage: 1.14V
  • Max Supply Voltage: 1.26V
  • Length: 37.5mm
  • Number of Pins: 740
  • Pin Count: 740
  • Weight: 10.784102g

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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