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  • Manufacturer No:
    SG1536Y/883B
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
  • Datasheet:
    SG1536Y/883B
  • SKU:
    11300693
  • Description:
    OPERATIONAL AMPLIFIER BIPOLAR MILITARY DUAL op amp amplifier circuit 80dB 2V/us 125C 1MHz

SG1536Y/883B Details

OPERATIONAL AMPLIFIER BIPOLAR MILITARY DUAL op amp amplifier circuit 80dB 2V/us 125C 1MHz

SG1536Y/883B Specification Parameters

  • Low-Offset: NO
  • Mount: Through Hole
  • ECCN Code: EAR99
  • RoHS Status: Non-RoHS Compliant
  • Min Operating Temperature: -55°C
  • Number of Terminations: 8
  • Max Operating Temperature: 125°C
  • Terminal Pitch: 2.54mm
  • Supply Voltage: 28V
  • Technology: BIPOLAR
  • Subcategory: Operational Amplifier
  • Architecture: VOLTAGE-FEEDBACK
  • Amplifier Type: OPERATIONAL AMPLIFIER
  • Package / Case: PDIP
  • Bias Current-Max (IIB) @25C: 0.02μA
  • Input Offset Voltage-Max: 7000μV
  • Length: 9.905mm
  • Neg Supply Voltage-Nom (Vsup): -28V
  • Packaging: Bulk
  • Number of Functions: 1
  • Radiation Hardening: No
  • Frequency Compensation: YES
  • Number of Pins: 8
  • Terminal Position: DUAL
  • JESD-609 Code: e0
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Max Dual Supply Voltage: 40V
  • Temperature Grade: Military
  • Gain Bandwidth Product: 1MHz
  • Supply Current-Max: 4mA
  • Common Mode Rejection Ratio: 80 dB
  • Unity Gain BW-Nom: 1000 kHz
  • Voltage Gain: 113.98dB
  • Average Bias Current-Max (IIB): 0.035μA
  • Slew Rate: 2 V/us

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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