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  • Manufacturer No:
    XC5VLX330T-1FF1738C
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    Get the PDF file
  • SKU:
    13359129
  • Description:
    FCBGA Tin/Lead (Sn63Pb37) Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 3.5mm 1V 1.4MB 85C
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  • Manufacturer No:
    XC5VLX330T-1FF1738C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC5VLX330T-1FF1738C
  • SKU:
    13359129
  • Description:
    FCBGA Tin/Lead (Sn63Pb37) Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 3.5mm 1V 1.4MB 85C

XC5VLX330T-1FF1738C Details

FCBGA Tin/Lead (Sn63Pb37) Surface Mount FIELD PROGRAMMABLE GATE ARRAY field programmable gate array 3.5mm 1V 1.4MB 85C

XC5VLX330T-1FF1738C Specification Parameters

  • Mount: Surface Mount
  • RoHS Status: RoHS Compliant
  • Pbfree Code: no
  • JESD-609 Code: e0
  • Max Operating Temperature: 85°C
  • Terminal Position: BOTTOM
  • Terminal Form: BALL
  • Operating Supply Voltage: 1V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Peak Reflow Temperature (Cel): 225
  • Terminal Finish: Tin/Lead (Sn63Pb37)
  • Length: 42.5mm
  • Number of Outputs: 960
  • RAM Size: 1.4MB
  • Number of Pins: 1738
  • Speed Grade: 1
  • Moisture Sensitivity Level (MSL): 4
  • Qualification Status: Not Qualified
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Min Operating Temperature: 0°C
  • Supply Voltage: 1V
  • Height Seated (Max): 3.5mm
  • Subcategory: Field Programmable Gate Arrays
  • Temperature Grade: OTHER
  • Package / Case: FCBGA
  • Width: 42.5mm
  • Number of I/O: 960
  • Number of Logic Elements/Cells: 331776
  • Number of Logic Blocks (LABs): 25920

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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