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XC2VP30-7FG676C123
  • Manufacturer No:
    XC2VP30-7FG676C
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    Get the PDF file
  • SKU:
    13725481
  • Description:
    CMOS OTHER RoHS Compliant BALL field programmable gate array 85C 306kB 0.28ns 1350MHz
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XC2VP30-7FG676C
  • Manufacturer No:
    XC2VP30-7FG676C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC2VP30-7FG676C
  • SKU:
    13725481
  • Description:
    CMOS OTHER RoHS Compliant BALL field programmable gate array 85C 306kB 0.28ns 1350MHz

XC2VP30-7FG676C Details

CMOS OTHER RoHS Compliant BALL field programmable gate array 85C 306kB 0.28ns 1350MHz

XC2VP30-7FG676C Specification Parameters

  • RoHS Status: RoHS Compliant
  • Moisture Sensitivity Level (MSL): 3
  • Qualification Status: Not Qualified
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Terminal Form: BALL
  • Operating Supply Voltage: 1.5V
  • Subcategory: Field Programmable Gate Arrays
  • Temperature Grade: OTHER
  • Number of Inputs: 416
  • ECCN Code: 3A991.D
  • Number of Terminations: 676
  • Clock Frequency: 1350MHz
  • Combinatorial Delay of a CLB-Max: 0.28 ns
  • Number of Registers: 27392
  • Surface Mount: YES
  • Pbfree Code: no
  • JESD-609 Code: e0
  • Max Operating Temperature: 85°C
  • Speed Grade: 7
  • HTS Code: 8542.39.00.01
  • Min Operating Temperature: 0°C
  • Supply Voltage: 1.5V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Peak Reflow Temperature (Cel): 225
  • Number of Outputs: 416
  • Package / Case: FBGA
  • Height Seated (Max): 2.44mm
  • Pin Count: 676
  • Number of CLBs: 3424
  • RAM Size: 306kB
  • Number of Logic Cells: 30816

Xilinx — Manufacturer Introduction

Xilinx
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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