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- Manufacturer No：10AS032E3F29I2LG
- Manufacturer：
- Category：Embedded - System On Chip (SoC)
- Datasheet：
Get the PDF file - SKU：1631813
- Description：BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 1.5GHz 0.9V
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- Manufacturer No：10AS032E3F29I2LG
- Manufacturer：Intel / Altera
- Category：Embedded - System On Chip (SoC)
- Datasheet：10AS032E3F29I2LG
- SKU：1631813
- Description：BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 1.5GHz 0.9V
User Guide
User Guide
10AS032E3F29I2LG Details
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 1.5GHz 0.9V
10AS032E3F29I2LG Specification Parameters
- Part Status: Active
- Surface Mount: YES
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Qualification Status: Not Qualified
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Subcategory: Field Programmable Gate Arrays
- Power Supplies: 0.9V
- Length: 29mm
- RAM Size: 256kB
- Peripherals: DMA, POR, WDT
- Number of Outputs: 360
- Number of Terminations: 780
- Supply Voltage-Max (Vsup): 0.93V
- Supply Voltage-Min (Vsup): 0.87V
- Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Package / Case: 780-BBGA, FCBGA
- Number of Logic Cells: 320000
- RoHS Status: RoHS Compliant
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Packaging: Tray
- Technology: CMOS
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage: 0.9V
- Operating Temperature: -40°C~100°C TJ
- Width: 29mm
- Architecture: MCU, FPGA
- Number of I/O: 360
- Number of Inputs: 360
- Speed: 1.5GHz
- Height Seated (Max): 3.35mm
- JESD-30 Code: S-PBGA-B780
- Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
- Series: Arria 10 SX
- Primary Attributes: FPGA - 320K Logic Elements
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Intel / Altera — Manufacturer Introduction
Intel enables designers of electronic systems to rapidly and cost effectively innovate, differentiate, and win in their markets. Intel offers FPGAs, SoCs, CPLDs, and Power Solutions, to provide high-value solutions to customers worldwide.
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