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Inventory:3076
  • Qty Unit Price price
  • 1 $14.748 $14.748
  • 10 $14.601 $146.01
  • 100 $14.456 $1445.6
  • 1000 $14.312 $14312
  • 10000 $14.17 $141700

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  • Manufacturer No:
    FFSD-20-D-06.00-01-N
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Cable Assemblies
  • Datasheet:
    FFSD-20-D-06.00-01-N
  • SKU:
    1712667
  • Description:
    CABLE ASSEM .05" 40POS F-F 6"

FFSD-20-D-06.00-01-N Details

CABLE ASSEM .05" 40POS F-F 6"

FFSD-20-D-06.00-01-N Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Lead Free: Lead Free
  • REACH SVHC: No SVHC
  • Number of Positions: 40
  • Height: 6.35mm
  • Termination: IDT
  • Connector Type: Socket to Socket
  • Color: Gray, Ribbon
  • Length: 0.500' 152.40mm 6.00
  • Cable Length: 152.4mm
  • Connector Type B: IDC, Receptacle
  • Weight: 45.359237mg
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Radiation Hardening: No
  • Contact Finish: Gold
  • Contact Finish Thickness: 10.0μin 0.25μm
  • Shielding: Unshielded
  • Pitch - Connector: 0.050 1.27mm
  • Cable Termination: IDC
  • Wire/Cable Type: Flat Flex
  • Pitch - Cable: 0.025 0.64mm
  • Width: 31.75mm
  • Material: Polybutylene
  • Connector Type A: IDC, Receptacle
  • Series: Tiger Eye? FFSD

Samtec Inc. — Manufacturer Introduction

Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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