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- Manufacturer No：2N7002DWQ-7-F
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Arrays
- Datasheet：2N7002DWQ-7-F
- SKU：1719056
- Description：MOSFET 2N-CH 60V 0.23A SOT363
User Guide
User Guide
2N7002DWQ-7-F Details
MOSFET 2N-CH 60V 0.23A SOT363
2N7002DWQ-7-F Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Number of Channels: 2
- Mount: Surface Mount
- ECCN Code: EAR99
- JESD-609 Code: e3
- Number of Terminations: 6
- Factory Lead Time: 16 Weeks
- Drain to Source Voltage (Vdss): 60V
- Max Junction Temperature (Tj): 150°C
- Transistor Element Material: SILICON
- Gate to Source Voltage (Vgs): 20V
- Transistor Application: SWITCHING
- Operating Mode: ENHANCEMENT MODE
- Subcategory: FET General Purpose Power
- FET Technology: METAL-OXIDE SEMICONDUCTOR
- Package / Case: 6-TSSOP, SC-88, SOT-363
- Continuous Drain Current (ID): 230mA
- Reference Standard: AEC-Q101
- Vgs(th) (Max) @ Id: 2V @ 250μA
- Power Dissipation: 310mW
- Input Capacitance (Ciss) (Max) @ Vds: 50pF @ 25V
- RoHS Status: ROHS3 Compliant
- Number of Elements: 2
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Pbfree Code: yes
- Contact Plating: Tin
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 40
- Published: 2010
- FET Feature: Standard
- Operating Temperature: -55°C~150°C TJ
- Height: 1.1mm
- Additional Feature: HIGH RELIABILITY
- Drain to Source Breakdown Voltage: 70V
- JESD-30 Code: R-PDSO-G6
- Turn On Delay Time: 7 ns
- Turn-Off Delay Time: 11 ns
- FET Type: 2 N-Channel (Dual)
- Max Power Dissipation: 310mW
- Feedback Cap-Max (Crss): 5 pF
- Rds On (Max) @ Id, Vgs: 7.5 Ω @ 50mA, 5V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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