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  • Manufacturer No:
    BAW56DWQ-7-F
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Diodes - Rectifiers - Single
  • Datasheet:
    BAW56DWQ-7-F
  • SKU:
    1721134
  • Description:
    DIODE GEN PURP 75V 150MA SOT-363

BAW56DWQ-7-F Details

DIODE GEN PURP 75V 150MA SOT-363

BAW56DWQ-7-F Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • Moisture Sensitivity Level (MSL): 1
  • Surface Mount: YES
  • Terminal Position: DUAL
  • Number of Terminations: 6
  • Terminal Form: GULL WING
  • Terminal Finish: Matte Tin (Sn)
  • Operating Temperature (Max): 150°C
  • Diode Type: Standard
  • Rep Pk Reverse Voltage-Max: 75V
  • Operating Temperature - Junction: -65°C~150°C
  • Current - Average Rectified (Io): 150mA
  • Additional Feature: HIGH RELIABILITY
  • JESD-30 Code: R-PDSO-G6
  • Output Current-Max: 0.15A
  • HTS Code: 8541.10.00.70
  • Reverse Recovery Time: 4ns
  • Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
  • Current - Reverse Leakage @ Vr: 2.5μA @ 75V
  • RoHS Status: ROHS3 Compliant
  • Packaging: Tape & Reel (TR)
  • ECCN Code: EAR99
  • JESD-609 Code: e3
  • Number of Elements: 4
  • Pin Count: 6
  • Peak Reflow Temperature (Cel): 260
  • Time@Peak Reflow Temperature-Max (s): 30
  • Diode Element Material: SILICON
  • Voltage - DC Reverse (Vr) (Max): 75V
  • Reverse Test Voltage: 75V
  • Factory Lead Time: 19 Weeks
  • Series: Automotive, AEC-Q101
  • Reverse Current-Max: 50μA
  • Power Dissipation-Max: 0.2W
  • Speed: Small Signal =< 200mA (Io), Any Speed
  • Package / Case: 6-TSSOP, SC-88, SOT-363
  • Subcategory: Other Diodes
  • Capacitance @ Vr, F: 2pF @ 0V 1MHz
  • Configuration: 2 BANKS, COMMON ANODE, 2 ELEMENTS

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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