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  • 1 $0.366 $0.366
  • 10 $0.362 $3.62
  • 100 $0.358 $35.8
  • 1000 $0.354 $354

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  • Manufacturer No:
    DMP2200UDW-7
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Transistors - FETs, MOSFETs - Arrays
  • Datasheet:
    DMP2200UDW-7
  • SKU:
    1721859
  • Description:
    MOSFET 2P-CH 20V 0.9A SOT363

DMP2200UDW-7 Details

MOSFET 2P-CH 20V 0.9A SOT363

DMP2200UDW-7 Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mounting Type: Surface Mount
  • Packaging: Tape & Reel (TR)
  • JESD-609 Code: e3
  • Number of Terminations: 6
  • Terminal Form: GULL WING
  • Published: 2015
  • Transistor Element Material: SILICON
  • FET Feature: Standard
  • DS Breakdown Voltage-Min: 20V
  • Transistor Application: SWITCHING
  • FET Technology: METAL-OXIDE SEMICONDUCTOR
  • Package / Case: 6-TSSOP, SC-88, SOT-363
  • Max Power Dissipation: 450mW
  • Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
  • Turn On Delay Time: 9.8 ns
  • Operating Mode: DUAL GATE, ENHANCEMENT MODE
  • Rise Time: 88ns
  • Input Capacitance (Ciss) (Max) @ Vds: 184pF @ 10V
  • RoHS Status: ROHS3 Compliant
  • Number of Elements: 2
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • Contact Plating: Tin
  • Number of Pins: 6
  • Peak Reflow Temperature (Cel): 260
  • Time@Peak Reflow Temperature-Max (s): 30
  • Factory Lead Time: 15 Weeks
  • Drain to Source Voltage (Vdss): 20V
  • Operating Temperature: -55°C~150°C TJ
  • Gate to Source Voltage (Vgs): 8V
  • Continuous Drain Current (ID): 900mA
  • Fall Time (Typ): 45 ns
  • FET Type: 2 P-Channel (Dual)
  • Drain Current-Max (Abs) (ID): 0.9A
  • Vgs(th) (Max) @ Id: 1.2V @ 250μA
  • Gate Charge (Qg) (Max) @ Vgs: 2.1nC @ 4.5V
  • Turn-Off Delay Time: 24.4 ns
  • Rds On (Max) @ Id, Vgs: 260m Ω @ 880mA, 4.5V

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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