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  • Manufacturer No:
    74LVC1G06FW4-7
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Logic - Buffers, Drivers, Receivers, Transceivers
  • Datasheet:
    74LVC1G06FW4-7
  • SKU:
    1724523
  • Description:
    ROHS3Compliant Gold DUAL CMOS Logic Buffer, Inverting -40C~125C 1.8V 0.4mm 8.5ns

74LVC1G06FW4-7 Details

ROHS3Compliant Gold DUAL CMOS Logic Buffer, Inverting -40C~125C 1.8V 0.4mm 8.5ns

74LVC1G06FW4-7 Specification Parameters

  • Part Status: Active
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Surface Mount
  • Packaging: Tape & Reel (TR)
  • Number of Circuits: 1
  • Radiation Hardening: No
  • JESD-609 Code: e4
  • Power Supplies: 3.3V
  • Number of Pins: 6
  • Technology: CMOS
  • Published: 2012
  • Time@Peak Reflow Temperature-Max (s): 40
  • Supply Voltage: 1.8V
  • Factory Lead Time: 19 Weeks
  • Height Seated (Max): 0.4mm
  • Quiescent Current: 200μA
  • Family: LVC/LCX/Z
  • Voltage - Supply: 1.65V~5.5V
  • Series: 74LVC
  • Propagation Delay: 3 ns
  • Turn On Delay Time: 8.5 ns
  • Terminal Pitch: 0.35mm
  • Base Part Number: 74LVC1G06
  • Schmitt Trigger: NO
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • Number of Functions: 1
  • Pbfree Code: yes
  • Contact Plating: Gold
  • Terminal Position: DUAL
  • Number of Terminations: 6
  • Pin Count: 6
  • REACH SVHC: No SVHC
  • Peak Reflow Temperature (Cel): 260
  • Supply Voltage-Max (Vsup): 5.5V
  • Operating Temperature: -40°C~125°C
  • Packing Method: TAPE AND REEL
  • Subcategory: Gates
  • Logic Type: Buffer, Inverting
  • Polarity: Inverting
  • Output Type: Open Drain
  • Max I(ol): 0.024 A
  • Logic Function: Buffer, Inverter
  • Package / Case: 6-XFDFN
  • Current - Output High, Low: - 32mA

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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