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- Manufacturer No：74LVC1G17SE-7
- Manufacturer：Diodes Incorporated
- Category：Logic - Buffers, Drivers, Receivers, Transceivers
- Datasheet：74LVC1G17SE-7
- SKU：1730092
- Description：74LVC1G17 Digi-Reel® 2003 Matte Tin (Sn) logic driver 32mA 32mA 14ns 1mm 3.3V
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74LVC1G17SE-7 Details
74LVC1G17 Digi-Reel® 2003 Matte Tin (Sn) logic driver 32mA 32mA 14ns 1mm 3.3V
74LVC1G17SE-7 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Outputs: 1
- Pbfree Code: yes
- JESD-609 Code: e3
- Output Type: Push-Pull
- Supply Voltage: 3.3V
- Schmitt Trigger Input: Yes
- Technology: CMOS
- Peak Reflow Temperature (Cel): 260
- Number of Pins: 5
- Terminal Finish: Matte Tin (Sn)
- Height: 1mm
- Packing Method: TAPE AND REEL
- Operating Temperature: -40°C~125°C TA
- Factory Lead Time: 23 Weeks
- Logic Type: Buffer, Non-Inverting
- Quiescent Current: 200μA
- Width: 1.35mm
- Packaging: Digi-Reel?
- Voltage - Supply: 1.65V~5.5V
- Max I(ol): 0.024 A
- Turn On Delay Time: 14 ns
- Current - Output High, Low: 32mA 32mA
- Output Characteristics: TOTEM POLE
- Base Part Number: 74LVC1G17
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Number of Functions: 1
- Number of Gates: 1
- Radiation Hardening: No
- Lead Free: Lead Free
- Terminal Position: DUAL
- Power Supplies: 3.3V
- Terminal Form: GULL WING
- REACH SVHC: No SVHC
- Number of Terminations: 5
- Pin Count: 5
- Time@Peak Reflow Temperature-Max (s): 40
- Published: 2003
- Operating Supply Current: 10μA
- Polarity: Non-Inverting
- Subcategory: Gates
- Length: 2.2mm
- Output Current: 32mA
- Family: LVC/LCX/Z
- Package / Case: 5-TSSOP, SC-70-5, SOT-353
- Series: 74LVC
- Prop. Delay@Nom-Sup: 7 ns
- Propagation Delay: 14 ns
- Input Type: Schmitt Trigger
- Logic Function: Buffer, Inverting, Schmitt Trigger
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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