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- Manufacturer No：DMN1150UFB-7B
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMN1150UFB-7B
- SKU：1738548
- Description：MOSFET N-CH 12V 1.41A 3DFN
User Guide
User Guide
DMN1150UFB-7B Details
MOSFET N-CH 12V 1.41A 3DFN
DMN1150UFB-7B Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Channels: 1
- Radiation Hardening: No
- JESD-609 Code: e4
- Number of Pins: 3
- REACH SVHC: No SVHC
- Drain to Source Breakdown Voltage: 12V
- Time@Peak Reflow Temperature-Max (s): 30
- Element Configuration: Single
- Gate to Source Voltage (Vgs): 6V
- Operating Temperature: -55°C~150°C TJ
- FET Type: N-Channel
- Transistor Application: SWITCHING
- Additional Feature: HIGH RELIABILITY
- Fall Time (Typ): 30 ns
- Width: 675μm
- Drive Voltage (Max Rds On,Min Rds On): 1.8V 4.5V
- Continuous Drain Current (ID): 1.41A
- Turn-Off Delay Time: 57 ns
- Length: 1.08mm
- Package / Case: 3-UFDFN
- Rds On (Max) @ Id, Vgs: 150m Ω @ 1A, 4.5V
- Current - Continuous Drain (Id) @ 25°C: 1.41A Ta
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Lead Free: Lead Free
- Number of Terminations: 3
- Published: 2013
- Peak Reflow Temperature (Cel): 260
- Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)
- Transistor Element Material: SILICON
- Factory Lead Time: 15 Weeks
- Terminal Position: BOTTOM
- Packaging: Cut Tape (CT)
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Case Connection: DRAIN
- Vgs(th) (Max) @ Id: 1V @ 250μA
- Subcategory: FET General Purpose Powers
- Turn On Delay Time: 4.1 ns
- Power Dissipation-Max: 500mW Ta
- Height: 480μm
- Vgs (Max): ±6V
- Gate Charge (Qg) (Max) @ Vgs: 1.5nC @ 4.5V
- Rise Time: 34.5 ns
- Input Capacitance (Ciss) (Max) @ Vds: 106pF @ 10V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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