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- Manufacturer No：DMP6023LSS-13
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMP6023LSS-13
- SKU：1739503
- Description：MOSFET P-Ch 60V Enh Mode 20Vgs 53.1nC 2569pF
User Guide
User Guide
DMP6023LSS-13 Details
MOSFET P-Ch 60V Enh Mode 20Vgs 53.1nC 2569pF
DMP6023LSS-13 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Number of Pins: 8
- Terminal Position: DUAL
- Terminal Form: GULL WING
- Terminal Finish: Matte Tin (Sn)
- Gate to Source Voltage (Vgs): 20V
- Package / Case: 8-SOIC (0.154, 3.90mm Width)
- Transistor Application: SWITCHING
- Vgs (Max): ±20V
- Additional Feature: HIGH RELIABILITY
- Configuration: SINGLE WITH BUILT-IN DIODE
- FET Type: P-Channel
- Vgs(th) (Max) @ Id: 3V @ 250μA
- Drain to Source Breakdown Voltage: -60V
- Rise Time: 7.1 ns
- Drain-source On Resistance-Max: 0.025Ohm
- Current - Continuous Drain (Id) @ 25°C: 6.6A Ta
- Input Capacitance (Ciss) (Max) @ Vds: 2569pF @ 30V
- Capacitance: 2.569nF
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- JESD-609 Code: e3
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Number of Terminations: 8
- Published: 2013
- Drain to Source Voltage (Vdss): 60V
- Transistor Element Material: SILICON
- Operating Temperature: -55°C~150°C TJ
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Pulsed Drain Current-Max (IDM): 50A
- Factory Lead Time: 23 Weeks
- Drive Voltage (Max Rds On,Min Rds On): 4.5V 10V
- Turn On Delay Time: 6 ns
- Turn-Off Delay Time: 110 ns
- Continuous Drain Current (ID): 6.6A
- Fall Time (Typ): 62 ns
- Power Dissipation-Max: 1.2W Ta
- Rds On (Max) @ Id, Vgs: 25m Ω @ 5A, 10V
- Gate Charge (Qg) (Max) @ Vgs: 53.1nC @ 10V
- Avalanche Energy Rating (Eas): 62.9 mJ
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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