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- Manufacturer No：DMN63D8LW-13
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMN63D8LW-13
- SKU：1740679
- Description：MOSFET N-CH 30V 0.38A SOT323
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User Guide
DMN63D8LW-13 Details
MOSFET N-CH 30V 0.38A SOT323
DMN63D8LW-13 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Terminal Position: DUAL
- Terminal Form: GULL WING
- Published: 2015
- Time@Peak Reflow Temperature-Max (s): 30
- Factory Lead Time: 14 Weeks
- Gate to Source Voltage (Vgs): 20V
- Operating Temperature: -55°C~150°C TJ
- Technology: MOSFET (Metal Oxide)
- Height: 1.1mm
- Vgs (Max): ±20V
- Power Dissipation: 300mW
- JESD-30 Code: R-PDSO-G3
- Drain-source On Resistance-Max: 4.5Ohm
- Vgs(th) (Max) @ Id: 1.5V @ 250μA
- Drive Voltage (Max Rds On,Min Rds On): 2.5V 10V
- Turn-Off Delay Time: 11.4 ns
- Gate Charge (Qg) (Max) @ Vgs: 0.9nC @ 10V
- Rds On (Max) @ Id, Vgs: 2.8 Ω @ 250mA, 10V
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- JESD-609 Code: e3
- Number of Terminations: 3
- Peak Reflow Temperature (Cel): 260
- Terminal Finish: Matte Tin (Sn)
- Max Junction Temperature (Tj): 150°C
- Transistor Element Material: SILICON
- Drain to Source Breakdown Voltage: 30V
- FET Type: N-Channel
- Transistor Application: SWITCHING
- Operating Mode: ENHANCEMENT MODE
- Additional Feature: HIGH RELIABILITY
- Configuration: SINGLE WITH BUILT-IN DIODE
- Package / Case: SC-70, SOT-323
- Continuous Drain Current (ID): 380mA
- Turn On Delay Time: 2.3 ns
- Drain Current-Max (Abs) (ID): 0.38A
- Power Dissipation-Max: 300mW Ta
- Current - Continuous Drain (Id) @ 25°C: 380mA Ta
- Input Capacitance (Ciss) (Max) @ Vds: 23.2pF @ 25V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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