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- Manufacturer No：DMP6250SE-13
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMP6250SE-13
- SKU：1746424
- Description：MOSFET P-CH 60V 2.1A SOT223
User Guide
User Guide
DMP6250SE-13 Details
MOSFET P-CH 60V 2.1A SOT223
DMP6250SE-13 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Channels: 1
- JESD-609 Code: e3
- Terminal Position: DUAL
- Number of Pins: 3
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- Element Configuration: Single
- Published: 2003
- Packaging: Cut Tape (CT)
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Additional Feature: HIGH RELIABILITY
- Height: 1.65mm
- JESD-30 Code: R-PDSO-G4
- Package / Case: TO-261-4, TO-261AA
- Weight: 7.994566mg
- Drain to Source Breakdown Voltage: -60V
- Turn On Delay Time: 6.3 ns
- Drain-source On Resistance-Max: 0.25Ohm
- Current - Continuous Drain (Id) @ 25°C: 2.1A Ta
- Rds On (Max) @ Id, Vgs: 250m Ω @ 1A, 10V
- Fall Time (Typ): 39.8 ns
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Contact Plating: Tin
- Number of Terminations: 4
- Terminal Form: GULL WING
- Drain to Source Voltage (Vdss): 60V
- Transistor Element Material: SILICON
- Gate to Source Voltage (Vgs): 20V
- Operating Temperature: -55°C~150°C TJ
- Factory Lead Time: 22 Weeks
- Transistor Application: SWITCHING
- Vgs (Max): ±20V
- Case Connection: DRAIN
- Drive Voltage (Max Rds On,Min Rds On): 4.5V 10V
- FET Type: P-Channel
- Vgs(th) (Max) @ Id: 3V @ 250μA
- Width: 3.55mm
- Continuous Drain Current (ID): 6.1A
- Length: 6.55mm
- Rise Time: 10.3 ns
- Gate Charge (Qg) (Max) @ Vgs: 9.7nC @ 10V
- Avalanche Energy Rating (Eas): 8 mJ
- Power Dissipation-Max: 1.8W Ta 14W Tc
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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