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- Manufacturer No：ZXMP6A16DN8QTA
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Arrays
- Datasheet：ZXMP6A16DN8QTA
- SKU：1763431
- Description：MOSFET 2P-CH 60V 2.9A 8-SOIC
User Guide
User Guide
ZXMP6A16DN8QTA Details
MOSFET 2P-CH 60V 2.9A 8-SOIC
ZXMP6A16DN8QTA Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Number of Channels: 2
- Mount: Surface Mount
- ECCN Code: EAR99
- JESD-609 Code: e3
- Number of Terminations: 8
- Peak Reflow Temperature (Cel): 260
- DS Breakdown Voltage-Min: 60V
- Time@Peak Reflow Temperature-Max (s): 30
- Transistor Element Material: SILICON
- Gate to Source Voltage (Vgs): 20V
- Operating Temperature: -55°C~150°C TJ
- Transistor Application: SWITCHING
- Additional Feature: HIGH RELIABILITY
- FET Technology: METAL-OXIDE SEMICONDUCTOR
- FET Feature: Logic Level Gate
- Reference Standard: AEC-Q101
- FET Type: 2 P-Channel (Dual)
- Vgs(th) (Max) @ Id: 1V @ 250μA (Min)
- Rise Time: 4.1ns
- Gate Charge (Qg) (Max) @ Vgs: 24.2nC @ 10V
- RoHS Status: ROHS3 Compliant
- Number of Elements: 2
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Pbfree Code: yes
- Number of Pins: 8
- Terminal Form: GULL WING
- Drain to Source Voltage (Vdss): 60V
- Terminal Finish: Matte Tin (Sn)
- Element Configuration: Dual
- Factory Lead Time: 15 Weeks
- Published: 2002
- Package / Case: 8-SOIC (0.154, 3.90mm Width)
- Operating Mode: ENHANCEMENT MODE
- Fall Time (Typ): 10 ns
- Turn-Off Delay Time: 35 ns
- Continuous Drain Current (ID): 2.9A
- Turn On Delay Time: 3.5 ns
- Weight: 73.992255mg
- Max Power Dissipation: 1.81W
- Rds On (Max) @ Id, Vgs: 85m Ω @ 2.9A, 10V
- Input Capacitance (Ciss) (Max) @ Vds: 1021pF @ 30V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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