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- Manufacturer No：PI49FCT3807HEX
- Manufacturer：Diodes Incorporated
- Category：Clock/Timing - Clock Buffers, Drivers
- Datasheet：PI49FCT3807HEX
- SKU：1765132
- Description：CMOS TTL 49FCT3807 20-SSOP (0.209 5.30mm Width) Obsolete clock buffer 5.3mm 0.024A 0.5ns 500mW
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User Guide
PI49FCT3807HEX Details
CMOS TTL 49FCT3807 20-SSOP (0.209 5.30mm Width) Obsolete clock buffer 5.3mm 0.024A 0.5ns 500mW
PI49FCT3807HEX Specification Parameters
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Circuits: 1
- Radiation Hardening: No
- Part Status: Obsolete
- Supply Voltage: 3.3V
- Operating Temperature: -40°C~85°C
- Peak Reflow Temperature (Cel): 260
- Number of Terminations: 20
- Terminal Finish: Matte Tin (Sn)
- Supply Voltage-Min (Vsup): 3V
- Factory Lead Time: 7 Weeks
- Max Power Dissipation: 500mW
- Terminal Pitch: 0.65mm
- Frequency (Max): 50MHz
- Voltage - Supply: 3V~3.6V
- Length: 7.2mm
- Differential - Input:Output: No/No
- Package / Case: 20-SSOP (0.209, 5.30mm Width)
- Family: FCT
- Input: CMOS, TTL
- Propagation Delay: 4.5 ns
- Same Edge Skew-Max (tskwd): 0.5 ns
- Series: 49FCT
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Functions: 1
- ECCN Code: EAR99
- JESD-609 Code: e3
- Terminal Position: DUAL
- Operating Supply Voltage: 3.3V
- Terminal Form: GULL WING
- Number of Pins: 20
- Number of Outputs: 10
- Time@Peak Reflow Temperature-Max (s): 40
- Height Seated (Max): 2mm
- Published: 2009
- Power Dissipation: 500mW
- Supply Voltage-Max (Vsup): 3.6V
- Load Capacitance: 50pF
- Width: 5.3mm
- Quiescent Current: 3μA
- Subcategory: Clock Drivers
- Max I(ol): 0.024 A
- Output: CMOS, TTL
- Type: Fanout Buffer (Distribution)
- Turn On Delay Time: 4.5 ns
- Ratio - Input:Output: 1:10
- Base Part Number: 49FCT3807
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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