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  • Manufacturer No:
    DMP2023UFDF-7
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Transistors - FETs, MOSFETs - Single
  • Datasheet:
    DMP2023UFDF-7
  • SKU:
    1775936
  • Description:
    Single P-Channel 20 V 90 mOhm 27 nC 0.73 W Silicon SMT Mosfet - UDFN-6

DMP2023UFDF-7 Details

Single P-Channel 20 V 90 mOhm 27 nC 0.73 W Silicon SMT Mosfet - UDFN-6

DMP2023UFDF-7 Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • Number of Elements: 1
  • JESD-609 Code: e4
  • Number of Terminations: 6
  • Peak Reflow Temperature (Cel): 260
  • Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)
  • Transistor Element Material: SILICON
  • DS Breakdown Voltage-Min: 20V
  • Operating Temperature: -55°C~150°C TJ
  • Transistor Application: SWITCHING
  • Configuration: SINGLE WITH BUILT-IN DIODE
  • FET Type: P-Channel
  • Vgs(th) (Max) @ Id: 1V @ 250μA
  • JESD-30 Code: S-PDSO-N6
  • Drive Voltage (Max Rds On,Min Rds On): 1.5V 4.5V
  • Gate Charge (Qg) (Max) @ Vgs: 27nC @ 4.5V
  • Current - Continuous Drain (Id) @ 25°C: 7.6A Ta
  • Input Capacitance (Ciss) (Max) @ Vds: 1837pF @ 15V
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Surface Mount
  • Packaging: Tape & Reel (TR)
  • ECCN Code: EAR99
  • Terminal Position: DUAL
  • Factory Lead Time: 16 Weeks
  • Published: 2015
  • Time@Peak Reflow Temperature-Max (s): 30
  • Drain to Source Voltage (Vdss): 20V
  • Terminal Form: NO LEAD
  • Technology: MOSFET (Metal Oxide)
  • Operating Mode: ENHANCEMENT MODE
  • Case Connection: DRAIN
  • Continuous Drain Current (ID): 7.6A
  • Vgs (Max): ±8V
  • Package / Case: 6-UDFN Exposed Pad
  • Drain-source On Resistance-Max: 0.027Ohm
  • Power Dissipation-Max: 730mW Ta
  • Rds On (Max) @ Id, Vgs: 27m Ω @ 7A, 4.5V

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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