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- Manufacturer No：DMN3135LVT-7
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Arrays
- Datasheet：DMN3135LVT-7
- SKU：1781602
- Description：MOSFET 2N-CH 30V 3.5A TSOT26
User Guide
User Guide
DMN3135LVT-7 Details
MOSFET 2N-CH 30V 3.5A TSOT26
DMN3135LVT-7 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- ECCN Code: EAR99
- Radiation Hardening: No
- Lead Free: Lead Free
- Number of Pins: 6
- Terminal Form: GULL WING
- Published: 2012
- Terminal Finish: Matte Tin (Sn)
- Transistor Element Material: SILICON
- Gate to Source Voltage (Vgs): 20V
- Drain to Source Breakdown Voltage: 30V
- Transistor Application: SWITCHING
- Additional Feature: HIGH RELIABILITY
- Subcategory: FET General Purpose Power
- Continuous Drain Current (ID): 3.5A
- Drain Current-Max (Abs) (ID): 3.3A
- FET Type: 2 N-Channel (Dual)
- Rise Time: 4.6 ns
- Turn On Delay Time: 2.6 ns
- Drain-source On Resistance-Max: 0.047Ohm
- Gate Charge (Qg) (Max) @ Vgs: 4.1nC @ 4.5V
- Rds On (Max) @ Id, Vgs: 60m Ω @ 3.1A, 10V
- RoHS Status: ROHS3 Compliant
- Number of Channels: 2
- Mount: Surface Mount
- Number of Elements: 1
- Pbfree Code: yes
- JESD-609 Code: e3
- Number of Terminations: 6
- Pin Count: 6
- REACH SVHC: No SVHC
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 40
- Factory Lead Time: 15 Weeks
- Drain to Source Voltage (Vdss): 30V
- Operating Temperature: -55°C~150°C TJ
- Operating Mode: ENHANCEMENT MODE
- Configuration: SINGLE WITH BUILT-IN DIODE
- FET Technology: METAL-OXIDE SEMICONDUCTOR
- Package / Case: SOT-23-6 Thin, TSOT-23-6
- FET Feature: Logic Level Gate
- Fall Time (Typ): 2.5 ns
- Vgs(th) (Max) @ Id: 2.2V @ 250μA
- Max Power Dissipation: 840mW
- Turn-Off Delay Time: 13.1 ns
- Input Capacitance (Ciss) (Max) @ Vds: 305pF @ 15V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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