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- Manufacturer No：BSS84V-7
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Arrays
- Datasheet：BSS84V-7
- SKU：1783180
- Description：MOSFET 2P-CH 50V 0.13A SOT-563
User Guide
User Guide
BSS84V-7 Details
MOSFET 2P-CH 50V 0.13A SOT-563
BSS84V-7 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Pbfree Code: yes
- JESD-609 Code: e3
- Contact Plating: Tin
- Drain to Source Voltage (Vdss): 50V
- Number of Pins: 6
- REACH SVHC: No SVHC
- Time@Peak Reflow Temperature-Max (s): 40
- Length: 1.6mm
- Gate to Source Voltage (Vgs): 15V
- Operating Temperature: -55°C~150°C TJ
- Width: 1.2mm
- Transistor Application: SWITCHING
- Max Power Dissipation: 150mW
- Continuous Drain Current (ID): 130mA
- Turn On Delay Time: 10 ns
- FET Feature: Logic Level Gate
- Package / Case: SOT-563, SOT-666
- FET Type: 2 P-Channel (Dual)
- Weight: 3.005049mg
- Input Capacitance (Ciss) (Max) @ Vds: 45pF @ 25V
- RoHS Status: ROHS3 Compliant
- Number of Elements: 2
- Mount: Surface Mount
- ECCN Code: EAR99
- Radiation Hardening: No
- Lead Free: Lead Free
- Published: 2013
- Number of Terminations: 6
- Pin Count: 6
- Peak Reflow Temperature (Cel): 260
- Element Configuration: Dual
- Transistor Element Material: SILICON
- Factory Lead Time: 19 Weeks
- Height: 600μm
- Terminal Form: FLAT
- Operating Mode: ENHANCEMENT MODE
- Power Dissipation: 150mW
- Resistance: 10Ohm
- FET Technology: METAL-OXIDE SEMICONDUCTOR
- Turn-Off Delay Time: 18 ns
- Drain to Source Breakdown Voltage: -50V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Drain Current-Max (Abs) (ID): 0.13A
- Rds On (Max) @ Id, Vgs: 10 Ω @ 100mA, 5V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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