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- Manufacturer No：DMN2013UFDE-7
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMN2013UFDE-7
- SKU：1783520
- Description：MOSFET N-CH 20V 10.5A U-DFN
User Guide
User Guide
DMN2013UFDE-7 Details
MOSFET N-CH 20V 10.5A U-DFN
DMN2013UFDE-7 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Radiation Hardening: No
- Number of Terminations: 3
- Pin Count: 6
- Published: 2012
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 40
- Drain to Source Voltage (Vdss): 20V
- Terminal Position: BOTTOM
- FET Type: N-Channel
- Transistor Application: SWITCHING
- Gate to Source Voltage (Vgs): 8V
- Case Connection: DRAIN
- Length: 2.05mm
- Continuous Drain Current (ID): 10.5A
- Package / Case: 6-UDFN Exposed Pad
- Height: 580μm
- Vgs(th) (Max) @ Id: 1.1V @ 250μA
- Current - Continuous Drain (Id) @ 25°C: 10.5A Ta
- Rise Time: 24.5 ns
- Input Capacitance (Ciss) (Max) @ Vds: 2453pF @ 10V
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- Pbfree Code: yes
- JESD-609 Code: e4
- Number of Pins: 6
- REACH SVHC: No SVHC
- Factory Lead Time: 16 Weeks
- Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)
- Transistor Element Material: SILICON
- DS Breakdown Voltage-Min: 20V
- Operating Temperature: -55°C~150°C TJ
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Configuration: SINGLE WITH BUILT-IN DIODE
- Subcategory: FET General Purpose Power
- Width: 2.05mm
- Vgs (Max): ±8V
- Drive Voltage (Max Rds On,Min Rds On): 1.5V 4.5V
- Turn On Delay Time: 9.9 ns
- Fall Time (Typ): 20.8 ns
- Power Dissipation-Max: 660mW Ta
- Rds On (Max) @ Id, Vgs: 11m Ω @ 8.5A, 4.5V
- Gate Charge (Qg) (Max) @ Vgs: 25.8nC @ 8V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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