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DMN2008LFU-7123
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DMN2008LFU-7
  • Manufacturer No:
    DMN2008LFU-7
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Transistors - FETs, MOSFETs - Arrays
  • Datasheet:
    DMN2008LFU-7
  • SKU:
    1786210
  • Description:
    MOSFET 2N-CHA 20V 14.5A DFN2030

DMN2008LFU-7 Details

MOSFET 2N-CHA 20V 14.5A DFN2030

DMN2008LFU-7 Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mounting Type: Surface Mount
  • Packaging: Tape & Reel (TR)
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • JESD-609 Code: e4
  • Number of Terminations: 6
  • Power - Max: 1W
  • Transistor Element Material: SILICON
  • Factory Lead Time: 17 Weeks
  • DS Breakdown Voltage-Min: 20V
  • Operating Temperature: -55°C~150°C TJ
  • Operating Mode: ENHANCEMENT MODE
  • FET Technology: METAL-OXIDE SEMICONDUCTOR
  • Continuous Drain Current (ID): 14.5A
  • Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE
  • Gate Charge (Qg) (Max) @ Vgs: 42.3nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds: 1418pF @ 10V
  • RoHS Status: ROHS3 Compliant
  • Number of Elements: 2
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Published: 2013
  • Max Power Dissipation: 1W
  • Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)
  • FET Feature: Standard
  • Drain to Source Voltage (Vdss): 20V
  • Terminal Form: NO LEAD
  • Transistor Application: SWITCHING
  • JESD-30 Code: R-PDSO-N6
  • Package / Case: 6-UFDFN Exposed Pad
  • FET Type: 2 N-Channel (Dual) Common Drain
  • Drain-source On Resistance-Max: 0.0096Ohm
  • Vgs(th) (Max) @ Id: 1.5V @ 250A
  • Rds On (Max) @ Id, Vgs: 5.4m Ω @ 5.5A, 4.5V

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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