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- Manufacturer No：BSS123-7
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：BSS123-7
- SKU：1811137
- Description：MOSFET N-CH 100V 170MA SOT23-3
User Guide
User Guide
BSS123-7 Details
MOSFET N-CH 100V 170MA SOT23-3
BSS123-7 Specification Parameters
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Terminal Position: DUAL
- Number of Pins: 3
- Lead Free: Contains Lead
- JESD-609 Code: e0
- REACH SVHC: No SVHC
- Drain to Source Breakdown Voltage: 100V
- Reach Compliance Code: not_compliant
- Drive Voltage (Max Rds On,Min Rds On): 10V
- Element Configuration: Single
- Gate to Source Voltage (Vgs): 20V
- Operating Temperature: -55°C~150°C TJ
- FET Type: N-Channel
- Width: 1.3mm
- Operating Mode: ENHANCEMENT MODE
- Vgs (Max): ±20V
- Subcategory: FET General Purpose Power
- Rise Time: 8ns
- Fall Time (Typ): 8 ns
- Continuous Drain Current (ID): 170mA
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Input Capacitance (Ciss) (Max) @ Vds: 60pF @ 25V
- Power Dissipation-Max: 300mW Ta
- Rds On (Max) @ Id, Vgs: 6 Ω @ 170mA, 10V
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- RoHS Status: Non-RoHS Compliant
- Number of Terminations: 3
- Pin Count: 3
- Qualification Status: Not Qualified
- Terminal Form: GULL WING
- Voltage - Rated DC: 100V
- Time@Peak Reflow Temperature-Max (s): 10
- Published: 2008
- Transistor Element Material: SILICON
- Height: 1mm
- Part Status: Discontinued
- Length: 2.9mm
- Technology: MOSFET (Metal Oxide)
- Transistor Application: SWITCHING
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Power Dissipation: 300mW
- Peak Reflow Temperature (Cel): 235
- Turn On Delay Time: 8 ns
- Current Rating: 170mA
- Turn-Off Delay Time: 13 ns
- Feedback Cap-Max (Crss): 6 pF
- Current - Continuous Drain (Id) @ 25°C: 170mA Ta
- Weight: 8.193012mg
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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