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- Manufacturer No：DMC3021LSD-13
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Arrays
- Datasheet：DMC3021LSD-13
- SKU：1811241
- Description：MOSFET N/P-CH 30V 8.5A/7A 8SO
User Guide
User Guide
DMC3021LSD-13 Details
MOSFET N/P-CH 30V 8.5A/7A 8SO
DMC3021LSD-13 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Pbfree Code: yes
- JESD-609 Code: e3
- Number of Terminations: 8
- Terminal Position: DUAL
- REACH SVHC: No SVHC
- Factory Lead Time: 16 Weeks
- Terminal Finish: Matte Tin (Sn)
- Transistor Element Material: SILICON
- Drain to Source Voltage (Vdss): 30V
- Operating Temperature: -55°C~150°C TJ
- Transistor Application: SWITCHING
- Height: 1.5mm
- Subcategory: Other Transistors
- Max Power Dissipation: 2.5W
- Length: 4.95mm
- Continuous Drain Current (ID): 8.5A
- FET Type: N and P-Channel
- Vgs(th) (Max) @ Id: 2.1V @ 250μA
- Gate Charge (Qg) (Max) @ Vgs: 16.1nC @ 10V
- Turn-Off Delay Time: 50.1 ns
- Current - Continuous Drain (Id) @ 25°C: 8.5A 7A
- RoHS Status: ROHS3 Compliant
- Number of Elements: 2
- Mount: Surface Mount
- ECCN Code: EAR99
- Radiation Hardening: No
- Number of Pins: 8
- Pin Count: 8
- Terminal Form: GULL WING
- Published: 2012
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 40
- Gate to Source Voltage (Vgs): 20V
- DS Breakdown Voltage-Min: 30V
- Package / Case: 8-SOIC (0.154, 3.90mm Width)
- Operating Mode: ENHANCEMENT MODE
- Additional Feature: HIGH RELIABILITY
- Power Dissipation: 2.5W
- FET Technology: METAL-OXIDE SEMICONDUCTOR
- FET Feature: Logic Level Gate
- Width: 3.95mm
- Polarity/Channel Type: N-CHANNEL AND P-CHANNEL
- Weight: 73.992255mg
- Rds On (Max) @ Id, Vgs: 21m Ω @ 7A, 10V
- Input Capacitance (Ciss) (Max) @ Vds: 767pF @ 10V
- Base Part Number: DMC3021
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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