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  • Manufacturer No:
    S1G-13
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Diodes - Rectifiers - Single
  • Datasheet:
    S1G-13
  • SKU:
    1811715
  • Description:
    DIODE GEN PURP 400V 1A SMA

S1G-13 Details

DIODE GEN PURP 400V 1A SMA

S1G-13 Specification Parameters

  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Number of Pins: 2
  • Mounting Type: Surface Mount
  • Number of Elements: 1
  • Radiation Hardening: No
  • Terminal Position: DUAL
  • Lead Free: Contains Lead
  • Termination: SMD/SMT
  • Time@Peak Reflow Temperature-Max (s): 10
  • Current Rating: 1A
  • Average Rectified Current: 1A
  • Published: 2005
  • Element Configuration: Single
  • Operating Temperature - Junction: -65°C~150°C
  • Max Reverse Voltage (DC): 400V
  • Reverse Voltage (DC): 400V
  • Packaging: Cut Tape (CT)
  • Peak Non-Repetitive Surge Current: 30A
  • HTS Code: 8541.10.00.80
  • Package / Case: DO-214AC, SMA
  • Subcategory: Rectifier Diodes
  • Forward Voltage: 1.1V
  • Width: 2.92mm
  • Length: 4.6mm
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 1A
  • Recovery Time: 3 μs
  • Capacitance @ Vr, F: 10pF @ 4V 1MHz
  • Base Part Number: S1G
  • Number of Terminations: 2
  • Pin Count: 2
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • RoHS Status: Non-RoHS Compliant
  • Pbfree Code: no
  • JESD-609 Code: e0
  • Min Operating Temperature: -65°C
  • Max Operating Temperature: 150°C
  • Output Current: 1A
  • Forward Current: 1A
  • Diode Element Material: SILICON
  • Diode Type: Standard
  • Voltage - Rated DC: 400V
  • Max Repetitive Reverse Voltage (Vrrm): 400V
  • Part Status: Discontinued
  • Max Surge Current: 30A
  • Capacitance: 10pF
  • Peak Reverse Current: 5μA
  • Terminal Form: C BEND
  • Speed: Standard Recovery >500ns, > 200mA (Io)
  • Terminal Finish: Tin/Lead (Sn85Pb15)
  • Peak Reflow Temperature (Cel): 235
  • Height: 2.1mm
  • Reverse Recovery Time: 3 μs
  • Current - Reverse Leakage @ Vr: 5μA @ 400V
  • Weight: 64.013223mg

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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