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  • Manufacturer No:
    ZMM5254B-7
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Diodes - Zener - Single
  • Datasheet:
    ZMM5254B-7
  • SKU:
    1824904
  • Description:
    DIODE ZENER 27V 500MW MINIMELF

ZMM5254B-7 Details

DIODE ZENER 27V 500MW MINIMELF

ZMM5254B-7 Specification Parameters

  • RoHS Status: ROHS3 Compliant
  • Number of Terminations: 2
  • Pin Count: 2
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • Lead Free: Lead Free
  • Pbfree Code: no
  • Published: 2012
  • Operating Temperature: -65°C~175°C
  • Voltage Tol-Max: 5%
  • Width: 1.6mm
  • Power Rating: 500mW
  • Power Dissipation: 500mW
  • Element Configuration: Single
  • Case Connection: ISOLATED
  • Diode Type: ZENER DIODE
  • Forward Voltage: 1.5V
  • JESD-609 Code: e2
  • Subcategory: Voltage Reference Diodes
  • Peak Reverse Current: 100nA
  • Terminal Form: WRAP AROUND
  • Reference Voltage: 27V
  • Voltage - Rated DC: 27V
  • Terminal Finish: Tin/Silver (Sn/Ag)
  • Package / Case: DO-213AC, MINI-MELF, SOD-80
  • Test Current: 4.6mA
  • Impedance: 41Ohm
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Number of Pins: 2
  • Mounting Type: Surface Mount
  • Number of Elements: 1
  • Radiation Hardening: No
  • Part Status: Obsolete
  • Tolerance: ±5%
  • Peak Reflow Temperature (Cel): 260
  • Time@Peak Reflow Temperature-Max (s): 40
  • Voltage Tolerance: 5%
  • Height: 1.6mm
  • Max Power Dissipation: 500mW
  • Diode Element Material: SILICON
  • Packaging: Cut Tape (CT)
  • Polarity: UNIDIRECTIONAL
  • HTS Code: 8541.10.00.50
  • Technology: ZENER
  • Additional Feature: HIGH RELIABILITY
  • Max Reverse Leakage Current: 100nA
  • Terminal Position: END
  • Length: 3.7mm
  • Zener Voltage: 27V
  • Working Voltage: 27V
  • Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
  • Weight: 33.991078mg
  • Impedance-Max: 41Ohm
  • Current - Reverse Leakage @ Vr: 100nA @ 21V

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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