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- Manufacturer No：ZVP3306ASTZ
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：ZVP3306ASTZ
- SKU：1832268
- Description：MOSFET P-CH 60V 0.16A TO92-3
User Guide
User Guide
ZVP3306ASTZ Details
MOSFET P-CH 60V 0.16A TO92-3
ZVP3306ASTZ Specification Parameters
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Through Hole
- Number of Channels: 1
- ECCN Code: EAR99
- Lead Free: Lead Free
- Number of Terminations: 3
- Qualification Status: Not Qualified
- Peak Reflow Temperature (Cel): 260
- Terminal Form: WIRE
- Time@Peak Reflow Temperature-Max (s): 40
- Transistor Element Material: SILICON
- Gate to Source Voltage (Vgs): 20V
- Operating Temperature: -55°C~150°C TJ
- Transistor Application: SWITCHING
- Vgs (Max): ±20V
- Rise Time: 8ns
- Weight: 453.59237mg
- Fall Time (Typ): 8 ns
- Power Dissipation: 625mW
- Package / Case: E-Line-3
- Vgs(th) (Max) @ Id: 3.5V @ 1mA
- Rds On (Max) @ Id, Vgs: 14 Ω @ 200mA, 10V
- Input Capacitance (Ciss) (Max) @ Vds: 50pF @ 18V
- Mounting Type: Through Hole
- Number of Elements: 1
- RoHS Status: RoHS Compliant
- JESD-609 Code: e3
- Part Status: Obsolete
- Pin Count: 3
- Published: 2012
- Drain to Source Voltage (Vdss): 60V
- Terminal Finish: Matte Tin (Sn)
- Drive Voltage (Max Rds On,Min Rds On): 10V
- Element Configuration: Single
- Packaging: Tape & Box (TB)
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Continuous Drain Current (ID): 160mA
- FET Type: P-Channel
- Turn On Delay Time: 8 ns
- Turn-Off Delay Time: 8 ns
- Voltage - Rated DC: -60V
- JESD-30 Code: R-PSIP-W3
- Power Dissipation-Max: 625mW Ta
- Current - Continuous Drain (Id) @ 25°C: 160mA Ta
- Current Rating: -160mA
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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