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  • Manufacturer No:
    ZVN3310ASTOA
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Transistors - FETs, MOSFETs - Single
  • Datasheet:
    ZVN3310ASTOA
  • SKU:
    1833954
  • Description:
    MOSFET N-CH 100V 200MA TO92-3

ZVN3310ASTOA Details

MOSFET N-CH 100V 200MA TO92-3

ZVN3310ASTOA Specification Parameters

  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Through Hole
  • Number of Elements: 1
  • RoHS Status: RoHS Compliant
  • JESD-609 Code: e3
  • Part Status: Obsolete
  • Pin Count: 3
  • Peak Reflow Temperature (Cel): 260
  • Drain to Source Breakdown Voltage: 100V
  • Terminal Form: WIRE
  • Published: 2006
  • Transistor Element Material: SILICON
  • Gate to Source Voltage (Vgs): 20V
  • Terminal Finish: MATTE TIN
  • Continuous Drain Current (ID): 200mA
  • Technology: MOSFET (Metal Oxide)
  • Operating Mode: ENHANCEMENT MODE
  • Drain Current-Max (Abs) (ID): 0.2A
  • Turn On Delay Time: 5 ns
  • Turn-Off Delay Time: 6 ns
  • Rise Time: 7 ns
  • JESD-30 Code: R-PSIP-W3
  • Power Dissipation-Max: 625mW Ta
  • Rds On (Max) @ Id, Vgs: 10 Ω @ 500mA, 10V
  • Mounting Type: Through Hole
  • Packaging: Tape & Reel (TR)
  • Number of Channels: 1
  • ECCN Code: EAR99
  • Lead Free: Lead Free
  • Number of Terminations: 3
  • Qualification Status: Not Qualified
  • Voltage - Rated DC: 100V
  • Reach Compliance Code: unknown
  • Time@Peak Reflow Temperature-Max (s): 40
  • Drive Voltage (Max Rds On,Min Rds On): 10V
  • Element Configuration: Single
  • Operating Temperature: -55°C~150°C TJ
  • Current Rating: 200mA
  • FET Type: N-Channel
  • Transistor Application: SWITCHING
  • Vgs (Max): ±20V
  • Weight: 453.59237mg
  • Power Dissipation: 625mW
  • Fall Time (Typ): 7 ns
  • Package / Case: E-Line-3
  • Current - Continuous Drain (Id) @ 25°C: 200mA Ta
  • Vgs(th) (Max) @ Id: 2.4V @ 1mA
  • Input Capacitance (Ciss) (Max) @ Vds: 40pF @ 25V

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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