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  • Manufacturer No:
    960106-6303-AR
  • Manufacturer:
    3M
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
    960106-6303-AR
  • SKU:
    2186259
  • Description:
    Headers & Wire Housings 6P STR SR BDMNT SKT 3.5MM TAIL/8.5MMBODY

960106-6303-AR Details

Headers & Wire Housings 6P STR SR BDMNT SKT 3.5MM TAIL/8.5MMBODY

960106-6303-AR Specification Parameters

  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Through Hole
  • RoHS Status: RoHS Compliant
  • Contact Finish - Mating: Gold
  • Color: Black
  • Housing Color: Black
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Pitch - Mating: 0.100 2.54mm
  • Contact Gender: Female
  • Fastening Type: Push-Pull
  • Packaging: Tray
  • Number of Positions: 6
  • Pitch: 2.54mm
  • Connector Type: Receptacle
  • Insulation Material: Thermoplastic
  • Style: Board to Board
  • Contact Type: Female Socket
  • Depth: 3mm
  • Current Rating (Amps): 2A
  • Contact Finish Thickness - Mating: Flash
  • Min Operating Temperature: -25°C
  • Lead Length: 3.5mm
  • Length: 15.24mm
  • Voltage - Rated: 1000VDC
  • Mounting Type: Through Hole
  • Number of Rows: 1
  • Radiation Hardening: No
  • Contact Plating: Gold
  • Insulation Color: Black
  • Termination: Solder
  • Part Status: Obsolete
  • Flammability Rating: UL94 V-0
  • Gender: Female
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Published: 2013
  • Number of Contacts: 6
  • Contact Material: Copper Alloy
  • Housing Material: Thermoplastic
  • Orientation: Straight
  • Factory Lead Time: 9 Weeks
  • Max Operating Temperature: 105°C
  • Current Rating: 2A
  • Max Current Rating: 2A
  • Contact Length - Post: 0.138 3.50mm
  • Insulation Height: 0.335 8.51mm
  • Operating Temperature: -25°C~105°C
  • Contact Finish Thickness - Post: 40.0μin 1.02μm
  • Series: 960

3M — Manufacturer Introduction

3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M? Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak? High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX? and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool? Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

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