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  • Manufacturer No:
    2908-05WB-MG
  • Manufacturer:
    3M
  • Category:
    Memory Connectors - PC Card Sockets
  • Datasheet:
    Get the PDF file
  • SKU:
    2271029
  • Description:
    CONN MICRO SD CARD PUSH-PUSH R/A
  • Quantity:
      • RFQ
      • Add To Cart
  • Material flow:
  • Payment:
Inventory:7508
  • Qty Unit Price price
  • 1 $3.475 $3.475
  • 10 $3.44 $34.4
  • 100 $3.405 $340.5
  • 1000 $3.371 $3371
  • 10000 $3.337 $33370

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  • Manufacturer No:
    2908-05WB-MG
  • Manufacturer:
    3M
  • Category:
    Memory Connectors - PC Card Sockets
  • Datasheet:
    2908-05WB-MG
  • SKU:
    2271029
  • Description:
    CONN MICRO SD CARD PUSH-PUSH R/A

2908-05WB-MG Details

CONN MICRO SD CARD PUSH-PUSH R/A

2908-05WB-MG Specification Parameters

  • Part Status: Active
  • Mount: Surface Mount
  • Number of Rows: 1
  • Radiation Hardening: No
  • Lead Free: Lead Free
  • Flammability Rating: UL94 V-0
  • Number of Positions: 8
  • Max Operating Temperature: 85°C
  • Body Material: Thermoplastic
  • REACH SVHC: Unknown
  • Contact Material: Copper
  • Current Rating: 500mA
  • Mounting Type: Surface Mount, Right Angle
  • Length: 14mm
  • Pitch: 1.1mm
  • Height Above Board: 0.073 1.85mm
  • Mounting Feature: Normal, Standard - Top
  • Depth: 15.2mm
  • Connector Type: Connector and Ejector
  • Series: 2900
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Packaging: Tape & Reel (TR)
  • RoHS Status: RoHS Compliant
  • Contact Finish: Gold
  • Termination: Solder
  • Gender: Male
  • Number of Contacts: 8
  • Housing Material: Thermoplastic
  • Published: 2006
  • Factory Lead Time: 20 Weeks
  • Orientation: Right Angle
  • Max Current Rating: 500mA
  • Min Operating Temperature: -25°C
  • Contact Finish Thickness: 15.0μin 0.38μm
  • Contact Plating: Gold, Silver
  • Feature: Switch
  • Width: 1.85mm
  • Insertion, Removal Method: Push In, Push Out
  • Card Type: Secure Digital - microSD?

3M — Manufacturer Introduction

3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M? Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak? High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX? and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool? Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

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Excellent

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