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  • Manufacturer No:
    CLM-112-02-L-D-A
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
    CLM-112-02-L-D-A
  • SKU:
    2678400
  • Description:
    CONN RCPT 24POS 0.039 GOLD SMD

CLM-112-02-L-D-A Details

CONN RCPT 24POS 0.039 GOLD SMD

CLM-112-02-L-D-A Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Pbfree Code: yes
  • Contact Finish - Mating: Gold
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Option: GENERAL PURPOSE
  • Gender: Female
  • Number of Positions Loaded: All
  • Contact Shape: Square
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • UL Flammability Code: 94V-0
  • Orientation: Straight
  • Total Number of Contacts: 24
  • Contact Type: Female Socket
  • Housing Material: Polymer
  • Feature: Board Guide
  • Contact Resistance: 15mOhm
  • Current Rating (Amps): 2.8A per Contact
  • Series: CLM
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mounting Type: Surface Mount
  • JESD-609 Code: e3
  • Lead Free: Lead Free
  • Termination: Solder
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Contact Material: Phosphor Bronze
  • Fastening Type: Push-Pull
  • Packaging: Tube
  • Depth: 2.54mm
  • Connector Type: Receptacle
  • Published: 2015
  • Number of Positions: 24
  • Style: Board to Board
  • Pitch - Mating: 0.039 1.00mm
  • Additional Feature: LOW PROFILE
  • Factory Lead Time: 1 Weeks
  • Row Spacing - Mating: 0.039 (1.00mm)
  • Insulation Height: 0.084 2.14mm
  • Length: 12.31mm

Samtec Inc. — Manufacturer Introduction

Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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