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- Manufacturer No：LCMXO2280C-3FTN256C
- Manufacturer：Lattice Semiconductor
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：LCMXO2280C-3FTN256C
- SKU：2712340
- Description：MachXO LCMXO2280 256-LBGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 1.55mm 3.3V 420MHz 5.1ns
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User Guide
LCMXO2280C-3FTN256C Details
MachXO LCMXO2280 256-LBGA Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) field programmable gate array 1.55mm 3.3V 420MHz 5.1ns
LCMXO2280C-3FTN256C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- Radiation Hardening: No
- Factory Lead Time: 8 Weeks
- Packaging: Tray
- Technology: CMOS
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 40
- Published: 2007
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- JESD-609 Code: e1
- Number of Terminations: 256
- Pin Count: 256
- Length: 17mm
- Operating Temperature: 0°C~85°C TJ
- Height Seated (Max): 1.55mm
- Package / Case: 256-LBGA
- Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Turn On Delay Time: 5.1 ns
- Programmable Logic Type: FLASH PLD
- Series: MachXO
- Number of I/O: 211
- Additional Feature: IT CAN ALSO OPERATE AT 2.5V AND 3.3V
- Total RAM Bits: 28262
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Pbfree Code: yes
- Lead Free: Lead Free
- Operating Supply Voltage: 3.3V
- Termination: SMD/SMT
- REACH SVHC: No SVHC
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage: 1.8V
- Number of Dedicated Inputs: 7
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Subcategory: Field Programmable Gate Arrays
- Number of Pins: 256
- Memory Type: SRAM
- Width: 17mm
- Output Function: MACROCELL
- Operating Supply Current: 23mA
- Frequency: 420MHz
- Propagation Delay: 5.1 ns
- Voltage - Supply: 1.71V~3.465V
- Number of LABs/CLBs: 285
- Number of Macro Cells: 1140
- Number of Outputs: 211
- Number of Logic Elements/Cells: 2280
- Base Part Number: LCMXO2280
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Lattice Semiconductor — Manufacturer Introduction
Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.
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