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  • Manufacturer No:
    LFE3-70EA-6FN672C
  • Manufacturer:
    Lattice Semiconductor
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    LFE3-70EA-6FN672C
  • SKU:
    2712347
  • Description:
    ECP3 LFE3-70 672-BBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 1.65mm 1.2V 375MHz 0.379ns

LFE3-70EA-6FN672C Details

ECP3 LFE3-70 672-BBGA Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) field programmable gate array 1.65mm 1.2V 375MHz 0.379ns

LFE3-70EA-6FN672C Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • Lead Free: Lead Free
  • Packaging: Tray
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • JESD-609 Code: e1
  • Operating Supply Voltage: 1.2V
  • Subcategory: Field Programmable Gate Arrays
  • Operating Supply Current: 18mA
  • Length: 27mm
  • Peak Reflow Temperature (Cel): 250
  • Voltage - Supply: 1.14V~1.26V
  • Pin Count: 672
  • Number of I/O: 380
  • Max Frequency: 375MHz
  • Series: ECP3
  • Total RAM Bits: 4526080
  • Number of Logic Elements/Cells: 67000
  • Combinatorial Delay of a CLB-Max: 0.379 ns
  • RoHS Status: ROHS3 Compliant
  • Mount: Surface Mount
  • Radiation Hardening: No
  • Factory Lead Time: 8 Weeks
  • Published: 2013
  • Time@Peak Reflow Temperature-Max (s): 30
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Supply Voltage: 1.2V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Height: 1.65mm
  • Operating Temperature: 0°C~85°C TJ
  • Width: 27mm
  • Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Number of Terminations: 672
  • Number of Pins: 672
  • Number of Outputs: 380
  • Package / Case: 672-BBGA
  • Number of LABs/CLBs: 8375
  • RAM Size: 552.5kB
  • Base Part Number: LFE3-70
  • Memory Size: 570.6kB

Lattice Semiconductor — Manufacturer Introduction

Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.

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