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- Manufacturer No：LFE2-12E-6QN208I
- Manufacturer：Lattice Semiconductor
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：LFE2-12E-6QN208I
- SKU：2719324
- Description：ECP2 LFE2-12 208-BFQFP Matte Tin (Sn) field programmable gate array 4.1mm 1.2V 357MHz 0.331ns
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User Guide
LFE2-12E-6QN208I Details
ECP2 LFE2-12 208-BFQFP Matte Tin (Sn) field programmable gate array 4.1mm 1.2V 357MHz 0.331ns
LFE2-12E-6QN208I Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- Radiation Hardening: No
- Lead Free: Lead Free
- Packaging: Tray
- Terminal Finish: Matte Tin (Sn)
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Position: QUAD
- Published: 2000
- Operating Supply Voltage: 1.2V
- Subcategory: Field Programmable Gate Arrays
- Length: 28mm
- Operating Temperature: -40°C~100°C TJ
- Number of Pins: 208
- Height Seated (Max): 4.1mm
- Voltage - Supply: 1.14V~1.26V
- Number of Logic Elements/Cells: 12000
- Series: ECP2
- Number of I/O: 131
- Total RAM Bits: 226304
- Base Part Number: LFE2-12
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Pbfree Code: yes
- JESD-609 Code: e3
- Factory Lead Time: 8 Weeks
- Terminal Form: GULL WING
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Terminal Pitch: 0.5mm
- HTS Code: 8542.39.00.01
- Supply Voltage: 1.2V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 245
- Width: 28mm
- Number of Terminations: 208
- Pin Count: 208
- Number of LABs/CLBs: 1500
- Package / Case: 208-BFQFP
- Clock Frequency: 357MHz
- Combinatorial Delay of a CLB-Max: 0.331 ns
- Number of Outputs: 131
- RAM Size: 27.6kB
- Memory Size: 30.6kB
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Lattice Semiconductor — Manufacturer Introduction
Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.
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