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  • Manufacturer No:
    LC5512MV-75F256C
  • Manufacturer:
    Lattice Semiconductor
  • Category:
    Embedded - CPLDs (Complex Programmable Logic Devices)
  • Datasheet:
    LC5512MV-75F256C
  • SKU:
    2725105
  • Description:
    YES 256-BGA 2000 LC5512 complex programmable logic device 200MHz 33mA 17mm 7.5ns

LC5512MV-75F256C Details

YES 256-BGA 2000 LC5512 complex programmable logic device 200MHz 33mA 17mm 7.5ns

LC5512MV-75F256C Specification Parameters

  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • JTAG BST: YES
  • Lead Free: Lead Free
  • Supply Voltage: 3.3V
  • Packaging: Tray
  • Qualification Status: Not Qualified
  • Number of Logic Elements/Blocks: 16
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Min Supply Voltage: 3V
  • Terminal Pitch: 1mm
  • Max Supply Voltage: 3.6V
  • Nominal Supply Current: 33mA
  • Terminal Form: BALL
  • Voltage Supply - Internal: 3V~3.6V
  • Number of Terminations: 256
  • Pin Count: 256
  • Terminal Finish: Tin/Lead (Sn63Pb37)
  • Width: 17mm
  • RAM Size: 32kB
  • Height Seated (Max): 2.1mm
  • Number of Macro Cells: 512
  • Package / Case: 256-BGA
  • Number of I/O: 193
  • Series: ispXPLD? 5000MV
  • Mount: Surface Mount
  • RoHS Status: Non-RoHS Compliant
  • Additional Feature: YES
  • Part Status: Obsolete
  • Operating Supply Voltage: 3.3V
  • Pbfree Code: no
  • JESD-609 Code: e0
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Reach Compliance Code: not_compliant
  • HTS Code: 8542.39.00.01
  • Terminal Position: BOTTOM
  • Operating Supply Current: 33mA
  • Published: 2000
  • Frequency: 200MHz
  • Number of Pins: 256
  • Peak Reflow Temperature (Cel): 225
  • Length: 17mm
  • Output Function: MACROCELL
  • Subcategory: Programmable Logic Devices
  • Propagation Delay: 7.5 ns
  • Programmable Type: In System Programmable
  • Operating Temperature: 0°C~90°C TJ
  • Memory Type: EEPROM, SRAM
  • Base Part Number: LC5512

Lattice Semiconductor — Manufacturer Introduction

Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.

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