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LFXP15C-3F256C123
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LFXP15C-3F256C
  • Manufacturer No:
    LFXP15C-3F256C
  • Manufacturer:
    Lattice Semiconductor
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    LFXP15C-3F256C
  • SKU:
    2728478
  • Description:
    1932CLBS XP LFXP15 256-BGA field programmable gate array 2.1mm 1.8V 320MHz 0.63ns

LFXP15C-3F256C Details

1932CLBS XP LFXP15 256-BGA field programmable gate array 2.1mm 1.8V 320MHz 0.63ns

LFXP15C-3F256C Specification Parameters

  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • RoHS Status: Non-RoHS Compliant
  • Part Status: Obsolete
  • Packaging: Tray
  • JESD-609 Code: e0
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Supply Voltage: 1.8V
  • Published: 2008
  • Terminal Position: BOTTOM
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Number of Terminations: 256
  • Pin Count: 256
  • Terminal Finish: Tin/Lead (Sn63Pb37)
  • Width: 17mm
  • Height Seated (Max): 2.1mm
  • Package / Case: 256-BGA
  • Number of Outputs: 188
  • Series: XP
  • Number of CLBs: 1932
  • Combinatorial Delay of a CLB-Max: 0.63 ns
  • Power Supplies: 1.8/2.5/3.3V
  • Number of Logic Blocks (LABs): 1875
  • Memory Size: 48.1kB
  • Mount: Surface Mount
  • Radiation Hardening: No
  • Lead Free: Lead Free
  • Number of Gates: 4
  • Pbfree Code: no
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Operating Supply Voltage: 1.8V
  • Terminal Pitch: 1mm
  • Terminal Form: BALL
  • Subcategory: Field Programmable Gate Arrays
  • Number of Pins: 256
  • Peak Reflow Temperature (Cel): 225
  • Length: 17mm
  • Operating Temperature: 0°C~85°C TJ
  • Frequency: 320MHz
  • Number of I/O: 188
  • Voltage - Supply: 1.71V~3.465V
  • Number of Logic Elements/Cells: 15000
  • Number of Logic Cells: 1932
  • Total RAM Bits: 331776
  • Base Part Number: LFXP15
  • RAM Size: 40.5kB
  • Organization: 1932 CLBS

Lattice Semiconductor — Manufacturer Introduction

Lattice Semiconductor
Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.

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