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  • Manufacturer No:
    LFE2M35E-6FN484C
  • Manufacturer:
    Lattice Semiconductor
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    LFE2M35E-6FN484C
  • SKU:
    2737726
  • Description:
    Lead Free 2008 ROHS3Compliant BALL FPGA 0C~85C TJ 271.5kB 0.331ns 357MHz

LFE2M35E-6FN484C Details

Lead Free 2008 ROHS3Compliant BALL FPGA 0C~85C TJ 271.5kB 0.331ns 357MHz

LFE2M35E-6FN484C Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • Lead Free: Lead Free
  • Packaging: Tray
  • REACH SVHC: No SVHC
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • JESD-609 Code: e1
  • Operating Supply Voltage: 1.2V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Length: 23mm
  • Operating Temperature: 0°C~85°C TJ
  • Number of Terminations: 484
  • Pin Count: 484
  • Voltage - Supply: 1.14V~1.26V
  • Number of Outputs: 303
  • Number of Macro Cells: 16000
  • Series: ECP2M
  • Number of Logic Cells: 35000
  • Number of LABs/CLBs: 4250
  • RAM Size: 262.6kB
  • Base Part Number: LFE2M35
  • RoHS Status: ROHS3 Compliant
  • Mount: Surface Mount
  • Pbfree Code: yes
  • Factory Lead Time: 8 Weeks
  • Qualification Status: Not Qualified
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Published: 2008
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Supply Voltage: 1.2V
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Subcategory: Field Programmable Gate Arrays
  • Width: 23mm
  • Height Seated (Max): 2.6mm
  • Number of Pins: 484
  • Peak Reflow Temperature (Cel): 250
  • Number of I/O: 303
  • Package / Case: 484-BBGA
  • Frequency: 357MHz
  • Combinatorial Delay of a CLB-Max: 0.331 ns
  • Number of Logic Elements/Cells: 34000
  • Total RAM Bits: 2151424
  • Memory Size: 271.5kB

Lattice Semiconductor — Manufacturer Introduction

Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.

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