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- Manufacturer No：LCMXO256C-3TN100C
- Manufacturer：Lattice Semiconductor
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：LCMXO256C-3TN100C
- SKU：2749887
- Description：MachXO LCMXO256 100-LQFP Matte Tin (Sn) field programmable gate array 1.6mm 3.3V 500MHz 4.9ns
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User Guide
LCMXO256C-3TN100C Details
MachXO LCMXO256 100-LQFP Matte Tin (Sn) field programmable gate array 1.6mm 3.3V 500MHz 4.9ns
LCMXO256C-3TN100C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- Radiation Hardening: No
- Lead Free: Lead Free
- Operating Supply Voltage: 3.3V
- Terminal Form: GULL WING
- Technology: CMOS
- Peak Reflow Temperature (Cel): 260
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage: 1.8V
- Number of LABs/CLBs: 32
- Number of Dedicated Inputs: 7
- HTS Code: 8542.39.00.01
- Number of Pins: 100
- Published: 2000
- Width: 14mm
- Subcategory: Field Programmable Gate Arrays
- Number of Logic Cells: 256
- Package / Case: 100-LQFP
- Number of I/O: 78
- Operating Temperature: 0°C~85°C TJ
- Operating Supply Current: 13mA
- Memory Size: 256B
- Propagation Delay: 4.9 ns
- Voltage - Supply: 1.71V~3.465V
- Series: MachXO
- Additional Feature: IT CAN ALSO OPERATE AT 2.5V AND 3.3V
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Pbfree Code: yes
- JESD-609 Code: e3
- Factory Lead Time: 8 Weeks
- Packaging: Tray
- Termination: SMD/SMT
- REACH SVHC: No SVHC
- Terminal Finish: Matte Tin (Sn)
- Time@Peak Reflow Temperature-Max (s): 30
- Height Seated (Max): 1.6mm
- Terminal Pitch: 0.5mm
- Terminal Position: QUAD
- Number of Terminations: 100
- Pin Count: 100
- Length: 14mm
- Number of Macro Cells: 128
- Number of Logic Elements/Cells: 256
- Memory Type: SRAM
- Frequency: 500MHz
- Number of Outputs: 78
- Output Function: MACROCELL
- RAM Size: 0B
- Density: 2 kb
- Turn On Delay Time: 4.9 ns
- Programmable Logic Type: FLASH PLD
- Weight: 657.000198mg
- Base Part Number: LCMXO256
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Lattice Semiconductor — Manufacturer Introduction
Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.
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