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- Manufacturer No：LFX125EB-03F256C
- Manufacturer：Lattice Semiconductor
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：LFX125EB-03F256C
- SKU：2755914
- Description：ispXPGA® LFX125 256-BGA Tin/Lead (Sn63Pb37) field programmable gate array 2.1mm 2.5V 320MHz 1.07ns
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User Guide
LFX125EB-03F256C Details
ispXPGA® LFX125 256-BGA Tin/Lead (Sn63Pb37) field programmable gate array 2.1mm 2.5V 320MHz 1.07ns
LFX125EB-03F256C Specification Parameters
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- Lead Free: Lead Free
- Packaging: Tray
- Qualification Status: Not Qualified
- Technology: CMOS
- Operating Supply Voltage: 2.5V
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Published: 2000
- Subcategory: Field Programmable Gate Arrays
- Number of Pins: 256
- Peak Reflow Temperature (Cel): 225
- Length: 17mm
- Operating Temperature: 0°C~85°C TJ
- Number of Outputs: 160
- Power Supplies: 2.5/3.3V
- Voltage - Supply: 2.3V~3.6V
- Package / Case: 256-BGA
- Additional Feature: ALSO OPERATES WITH 3.3V SUPPLY
- Series: ispXPGA?
- Combinatorial Delay of a CLB-Max: 1.07 ns
- Memory Size: 15.3kB
- Mount: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Part Status: Obsolete
- Pbfree Code: no
- JESD-609 Code: e0
- Supply Voltage: 2.5V
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Reach Compliance Code: not_compliant
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations: 256
- Pin Count: 256
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Width: 17mm
- Number of I/O: 160
- Number of CLBs: 484
- Height Seated (Max): 2.1mm
- Clock Frequency: 320MHz
- Total RAM Bits: 94208
- RAM Size: 11.5kB
- Number of Logic Elements/Cells: 1936
- Number of Gates: 139000
- Base Part Number: LFX125
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Lattice Semiconductor — Manufacturer Introduction
Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.
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