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  • Manufacturer No:
    GS4910BCNE3
  • Manufacturer:
  • Category:
    Clock/Timing - Application Specific
  • Datasheet:
    Get the PDF file
  • SKU:
    3037069
  • Description:
    64-VFQFN Exposed Pad Video Genlock LVCMOS LVTTL Crystal Surface Mount application specific IC 1.71V~3.465V 165MHz 0C~70C 3 (168Hours)
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  • Manufacturer No:
    GS4910BCNE3
  • Manufacturer:
    Semtech
  • Category:
    Clock/Timing - Application Specific
  • Datasheet:
    GS4910BCNE3
  • SKU:
    3037069
  • Description:
    64-VFQFN Exposed Pad Video Genlock LVCMOS LVTTL Crystal Surface Mount application specific IC 1.71V~3.465V 165MHz 0C~70C 3 (168Hours)

GS4910BCNE3 Details

64-VFQFN Exposed Pad Video Genlock LVCMOS LVTTL Crystal Surface Mount application specific IC 1.71V~3.465V 165MHz 0C~70C 3 (168Hours)

GS4910BCNE3 Specification Parameters

  • Part Status: Active
  • Mount: Surface Mount
  • RoHS Status: RoHS Compliant
  • Lead Free: Lead Free
  • Factory Lead Time: 16 Weeks
  • Published: 2002
  • Operating Temperature: 0°C~70°C
  • Package / Case: 64-VFQFN Exposed Pad
  • Voltage - Supply: 1.71V~3.465V
  • Input: LVCMOS, LVTTL, Crystal
  • Main Purpose: Video Genlock
  • Mounting Type: Surface Mount
  • Number of Circuits: 1
  • PLL: No
  • Packaging: Tray
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Number of Pins: 64
  • Differential - Input:Output: No/Yes
  • Consumer IC Type: CONSUMER CIRCUIT
  • Frequency (Max): 165MHz
  • Output: LVCMOS, LVDS, LVTTL
  • Ratio - Input:Output: 5:11

Semtech — Manufacturer Introduction

Semtech Corporation is a leading supplier of high-performance analog and mixed-signal semiconductor platforms and advanced algorithms. We are dedicated to providing proprietary platforms, differentiated by innovation, size, efficiency, performance and reach. Our solutions are used in some of the most innovative systems and products in the fastest growing markets today. These markets include smartphones, LCD TVs, notebooks, tablets, smart grid, automotive, automatic meter reading, medical, wireless infrastructure, PON, Internet of Things, optical transport and datacenters.

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