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- Manufacturer No：GS9074ACNE3
- Manufacturer：Semtech
- Category：Linear - Video Processing
- Datasheet：GS9074ACNE3
- SKU：3046233
- Description：Cable Equalizer Tray GS9074 Surface Mount video processing unit 360Mbps 4mm 65mA 3.465V
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GS9074ACNE3 Details
Cable Equalizer Tray GS9074 Surface Mount video processing unit 360Mbps 4mm 65mA 3.465V
GS9074ACNE3 Specification Parameters
- Mounting Type: Surface Mount
- Number of Functions: 1
- Pbfree Code: yes
- Lead Free: Lead Free
- Supply Voltage: 3.3V
- Packaging: Tray
- Number of Pins: 16
- Pin Count: 16
- REACH SVHC: No SVHC
- Time@Peak Reflow Temperature-Max (s): 20
- Max Operating Temperature: 70°C
- HTS Code: 8542.39.00.01
- Terminal Pitch: 0.65mm
- Width: 4mm
- Technology: BICMOS
- Height Seated (Max): 0.9mm
- Max Supply Voltage: 3.465V
- Interface: Analog
- Applications: Video
- Power Consumption: 215mW
- Data Rate: 360 Mbps
- Mount: Surface Mount
- RoHS Status: RoHS Compliant
- Radiation Hardening: No
- Factory Lead Time: 8 Weeks
- Operating Supply Voltage: 3.3V
- Temperature Grade: COMMERCIAL
- Number of Terminations: 16
- Termination: SMD/SMT
- Peak Reflow Temperature (Cel): 260
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Terminal Position: QUAD
- Part Status: Not For New Designs
- Published: 2002
- Length: 4mm
- Min Operating Temperature: 0°C
- Nominal Supply Current: 65mA
- Min Supply Voltage: 3.135V
- Subcategory: Other Telecom ICs
- Package / Case: 16-VQFN Exposed Pad
- Type: Cable Equalizer
- Base Part Number: GS9074
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Semtech — Manufacturer Introduction
Semtech Corporation is a leading supplier of high-performance analog and mixed-signal semiconductor platforms and advanced algorithms. We are dedicated to providing proprietary platforms, differentiated by innovation, size, efficiency, performance and reach. Our solutions are used in some of the most innovative systems and products in the fastest growing markets today. These markets include smartphones, LCD TVs, notebooks, tablets, smart grid, automotive, automatic meter reading, medical, wireless infrastructure, PON, Internet of Things, optical transport and datacenters.
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