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- Manufacturer No：MPC860ENCZQ66D4
- Manufacturer：NXP USA Inc.
- Category：Embedded - Microprocessors
- Datasheet：MPC860ENCZQ66D4
- SKU：3097891
- Description：MPC8xx Microprocessor IC series 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
User Guide
User Guide
MPC860ENCZQ66D4 Details
MPC8xx Microprocessor IC series 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
MPC860ENCZQ66D4 Specification Parameters
- Graphics Acceleration: No
- Surface Mount: YES
- Boundary Scan: YES
- Factory Lead Time: 12 Weeks
- Power Supplies: 3.3V
- Packaging: Tray
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Bit Size: 32
- Address Bus Width: 32
- Terminal Position: BOTTOM
- Clock Frequency: 50MHz
- HTS Code: 8542.31.00.01
- Supply Voltage-Max (Vsup): 3.465V
- RAM Controllers: DRAM
- ECCN Code: 3A991.A.2
- Published: 1995
- uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
- Number of Terminations: 357
- Co-Processors/DSP: Communications; CPM
- Height Seated (Max): 2.52mm
- JESD-30 Code: S-PBGA-B357
- Base Part Number: MPC860
- Ethernet: 10Mbps (4)
- RoHS Status: Non-RoHS Compliant
- Low Power Mode: YES
- Integrated Cache: YES
- Supply Voltage: 3.3V
- Voltage - I/O: 3.3V
- JESD-609 Code: e0
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Terminal Pitch: 1.27mm
- External Data Bus Width: 32
- Part Status: Not For New Designs
- Terminal Form: BALL
- Length: 25mm
- Peak Reflow Temperature (Cel): 245
- Supply Voltage-Min (Vsup): 3.135V
- Speed: 66MHz
- Number of Cores/Bus Width: 1 Core 32-Bit
- Format: FIXED POINT
- Subcategory: Microprocessors
- Series: MPC8xx
- Package / Case: 357-BBGA
- Terminal Finish: Tin/Lead/Silver (Sn/Pb/Ag)
- Operating Temperature: -40°C~95°C TA
- Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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