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- Manufacturer No：CY14B108M-ZSP25XI
- Manufacturer：Cypress Semiconductor Corp
- Category：Memory
- Datasheet：CY14B108M-ZSP25XI
- SKU：3820840
- Description：NVSRAM (Non-Volatile SRAM) Memory IC 8Mb (512K x 16) Parallel 54-TSOP II
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CY14B108M-ZSP25XI Details
NVSRAM (Non-Volatile SRAM) Memory IC 8Mb (512K x 16) Parallel 54-TSOP II
CY14B108M-ZSP25XI Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Number of Functions: 1
- JESD-609 Code: e3
- Contact Plating: Tin
- Factory Lead Time: 12 Weeks
- Memory Width: 16
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage: 3V
- Published: 2005
- Supply Voltage-Max (Vsup): 3.6V
- Terminal Pitch: 0.8mm
- Height Seated (Max): 1.2mm
- Voltage - Supply: 2.7V~3.6V
- Number of Pins: 54
- Nominal Supply Current: 75mA
- Word Size: 16b
- Access Time (Max): 25 ns
- Write Cycle Time - Word, Page: 25ns
- Standby Current-Max: 0.01A
- Technology: NVSRAM (Non-Volatile SRAM)
- Density: 8 Mb
- Time Format: HH:MM:SS
- Length: 22.415mm
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- Radiation Hardening: No
- Lead Free: Lead Free
- Terminal Position: DUAL
- Packaging: Tray
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 30
- Operating Supply Voltage: 3V
- Operating Temperature: -40°C~85°C TA
- Supply Voltage-Min (Vsup): 2.7V
- Memory Interface: Parallel
- Memory Type: Non-Volatile
- Number of Terminations: 54
- Pin Count: 54
- Data Bus Width: 16b
- Logic Function: Clock
- Subcategory: SRAMs
- ECCN Code: 3A991.B.2.A
- Memory Format: NVSRAM
- Package / Case: 54-TSOP (0.400, 10.16mm Width)
- Organization: 512KX16
- Memory Size: 8Mb 512K x 16
- Base Part Number: CY14B108
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Cypress Semiconductor Corp — Manufacturer Introduction
Cypress targets innovative markets growing faster than the overall semiconductor industry, including key segments of the automotive, industrial, home automation and appliances, medical products and consumer electronics businesses. With the help of Digi-Key Electronics, we supply customers with market-leading solutions based on our MCUs, wireless SoCs, memories, analog ICs and USB controllers. Our world-class wireless technology gives us an unparalleled position in the fast-growing Internet of Things, a business that cuts across our conventional markets and gives us a stake in exciting, next-generation segments such as connected and autonomous cars.
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